Senior Staff Product Package Engineer - Sustaining Power ICs

Aitomic Jobs; Malaysia; Hybrid; MYR 90,000 - 130,000; Full time

Job summary

Renesas Electronics in Malaysia is seeking a Staff/Sr Staff Product Package Engineer to sustain high-volume production of power IC packages. The role focuses on sustaining engineering activities, optimizing SPS and package processes, and improving COGS while ensuring long-term product quality and manufacturability.

You will collaborate with cross-functional teams across design, test, and manufacturing to support mature products, drive design improvements, and resolve customer issues.

Qualifications

• Minimum 5 years of experience in package development and process engineering.
• Bachelor’s Degree in Mechanical, Electrical/Electronic, Physics, or Materials.
• Experience in CuClip thin die assembly and SPS solder attach.
• Strong data manipulation and analysis skills.
• On-site work in Bayan Lepas, Malaysia.

Responsibilities

• Own multiple product lifecycles and oversee line readiness.
• Monitor and resolve manufacturing issues with fab and test sites.
• Drive package design improvements and cost reductions (COGS).
• Collaborate with design, test, manufacturing, package and quality teams.
• Mitigate risk via MRB/PCRB and product qualifications.

Skills

Package development

Process engineering

Data analysis

English communication

Education

Bachelor’s Degree in Mechanical/Electrical/Electronic/Materials

Tools

JMP

PDF Exenso

Job description

Renesas Electronics in Malaysia is seeking a Staff/Sr Staff Product Package Engineer to sustain high-volume production of power IC packages. The role focuses on sustaining engineering activities, optimizing SPS and package processes, and improving COGS while ensuring long-term product quality and manufacturability.

You will collaborate with cross-functional teams across design, test, and manufacturing to support mature products, drive design improvements, and resolve customer issues.