Senior Packaging Engineering: Innovation & Scale Leader

SANDISK; Batu Kawan; Vor Ort; MYR 180.000 - 260.000; Vollzeit

Zusammenfassung

Sandisk in Penang, Malaysia seeks a Senior Packaging Engineer to drive innovative packaging solutions across product lines. You will shape technical direction, own the package lifecycle from design to manufacturing, and partner with global factories to deliver high-volume, cost-effective packaging.

The role requires a Master’s or PhD with 8–10 years of experience, deep knowledge of SMT/PCBA, reliability, and advanced packaging technologies, plus ML/data analytics experience.

Qualifikationen

• Master’s degree required; PhD preferred.
• 10+ years with Master’s or 8+ years with PhD in packaging engineering or related fields.
• Strong understanding of SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.

Aufgaben

• Lead package engineering as cross-functional lead, ensuring design, qualification and release to production on schedule.
• Own the package lifecycle from design to manufacturing, aligning global teams and factories.
• Drive high-volume introduction of new package designs and advanced assembly processes.
• Define and qualify next generation packaging technologies aligned with product roadmaps.
• Lead cost reduction and yield improvement initiatives across product lines.
• Oversee budgets and develop scalable packaging infrastructure for future growth.
• Guide readiness of FMEA, SOD, Control Plans, process recipes, SPC for high-volume production.
• Provide technical leadership in design option evaluation via characterization builds and DFX analyses.

Kenntnisse

Problem solving

Communication

Thermo-mechanical packaging

Roadmap development

Mentoring engineers

Benchmarking

Packaging technologies

Ausbildung

Master’s degree in Material Science, Manufacturing, Mechanical Engineering, CS, Physics

PhD in relevant engineering field

Tools

Machine learning

Data analytics

AI technologies

Jobbeschreibung

Sandisk in Penang, Malaysia seeks a Senior Packaging Engineer to drive innovative packaging solutions across product lines. You will shape technical direction, own the package lifecycle from design to manufacturing, and partner with global factories to deliver high-volume, cost-effective packaging.

The role requires a Master’s or PhD with 8–10 years of experience, deep knowledge of SMT/PCBA, reliability, and advanced packaging technologies, plus ML/data analytics experience.