Senior Packaging Engineering (Package Development & Technology)

SANDISK; Batu Kawan; Presencial; MYR 180 000 - 260 000; Tempo integral

Resumo da oferta

Sandisk in Penang, Malaysia seeks a Senior Packaging Engineer to drive innovative packaging solutions across product lines. You will shape technical direction, own the package lifecycle from design to manufacturing, and partner with global factories to deliver high-volume, cost-effective packaging.

The role requires a Master’s or PhD with 8–10 years of experience, deep knowledge of SMT/PCBA, reliability, and advanced packaging technologies, plus ML/data analytics experience.

Qualificações

• Master’s degree required; PhD preferred.
• 10+ years with Master’s or 8+ years with PhD in packaging engineering or related fields.
• Strong understanding of SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.

Responsabilidades

• Lead package engineering as cross-functional lead, ensuring design, qualification and release to production on schedule.
• Own the package lifecycle from design to manufacturing, aligning global teams and factories.
• Drive high-volume introduction of new package designs and advanced assembly processes.
• Define and qualify next generation packaging technologies aligned with product roadmaps.
• Lead cost reduction and yield improvement initiatives across product lines.
• Oversee budgets and develop scalable packaging infrastructure for future growth.
• Guide readiness of FMEA, SOD, Control Plans, process recipes, SPC for high-volume production.
• Provide technical leadership in design option evaluation via characterization builds and DFX analyses.

Conhecimentos

Problem solving

Communication

Thermo-mechanical packaging

Roadmap development

Mentoring engineers

Benchmarking

Packaging technologies

Formação académica

Master’s degree in Material Science, Manufacturing, Mechanical Engineering, CS, Physics

PhD in relevant engineering field

Ferramentas

Machine learning

Data analytics

AI technologies

Descrição da oferta de emprego

We are seeking a detail-oriented and analytical Senior Packaging Engineering to join our team in Penang, Malaysia. In this role, you will drive innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines. You will collaborate with cross-functional teams to design, develop, and optimize packaging systems that meet customer requirements and regulatory standards. The ideal candidate will bring a systematic approach to problem-solving and a commitment to continuous improvement in packaging technology.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Serve as the Package Engineering representative on cross functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements.
• Provide end to end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross functional engineering teams, global factories, and key stakeholders.
• Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost effective high volume introduction of new package designs and advanced assembly processes.
• Partner with Packaging R&D organizations worldwide to define, develop, and qualify next generation and emerging packaging technologies in alignment with long term business strategy and product roadmaps
• Drive enterprise level assembly yield improvement initiatives and package cost reduction programs, establishing best practices and measurable performance targets across supported product lines.
• Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions.
• Lead new products through the transition from low volume to high volume manufacturing, ensuring yield, quality, and reliability objectives are achieved. Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high volume production.
• Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level.

Qualifications REQUIRED:

• Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
• Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD.
• Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout
• Additional expertise in flash back-end process for active components manufacturing is a plus
• Experience with machine learning and data analytics utilizing AI technologies.

SKILLS:

• Strong problem-solving skills with demonstrated expertise in experimental design and statistical analysis
• Excellent written and verbal communication skills with the ability to collaborate effectively with global cross-functional teams
• Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives
• Assist in developing and maintaining the Package Technology Roadmap, working with global assembly, and packaging teams.
• Demonstrated experience mentoring or managing junior engineers is a plus
• Continuously track major industry benchmark announcements in packaging and proactively build organizational awareness of competitive and emerging benchmark strategies
• Familiarity with industry benchmarking trends and packaging technology roadmap development.

Notice to Candidates

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ••••@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

Additional Information

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at ••••@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

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