Senior Packaging Engineer – AI-Driven MEMS

SanDisk; Batu Kawan; On-site; MYR 60,000 - 120,000; Full time

Job summary

Sandisk in Malaysia seeks an Engineer, Packaging Engineering to drive technology roadmaps for next-gen memory packaging solutions. You will integrate data pipelines, conduct experiments, and collaborate with cross-functional teams to deliver robust automation and AI-enabled improvements.

The role requires a degree in engineering and 3+ years of relevant experience, with strong analytical and communication skills and a track record in packaging development.

Qualifications

• Bachelor’s or master’s degree in mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline.
• Min 3 years relevant working experience.
• Track record of AI/ML experience is added advantage.
• Demonstrated track record to pathfinding and development new SMT/FC/UF/Mold/TIM material with vendors and utilizing test methodology to qualify new material in factory.
• Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
• Strong attention to detail and commitment to achieving goals.
• Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology & wafer level packaging solutions.

Responsibilities

• Drive technology solutions for next-gen memory storage packaging products.
• Integrate assembly/test data pipeline; analyze and transform process data.
• Conduct in-depth investigations/characterization in packaging development.
• Design experiments to troubleshoot process issues and validate improvements.
• Foster culture of engineering investigation and root-cause problem solving.
• Collaborate with process, equipment, automation and IT teams to deliver automation and AI solutions.

Skills

JMP software

Packaging technology development

Analytical thinking

Industry 4.0 / digital dashboards

Communication & teamwork

Self-motivated & organized

Multitasking in dynamic environment

Education

Bachelor’s or Master’s degree in mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering

Tools

JMP software

Job description

Sandisk in Malaysia seeks an Engineer, Packaging Engineering to drive technology roadmaps for next-gen memory packaging solutions. You will integrate data pipelines, conduct experiments, and collaborate with cross-functional teams to deliver robust automation and AI-enabled improvements.

The role requires a degree in engineering and 3+ years of relevant experience, with strong analytical and communication skills and a track record in packaging development.