Senior SMT Process & Package Engineer

Sandisk

Simpang Ampat

On-site

MYR 180,000 - 240,000

Full time

21 hours ago

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Job summary

Sandisk invites a seasoned engineer to join our team in Malaysia to develop SSD assembly and IC packaging materials and processes. You will qualify new SMT materials for NPI, design experiments, and help drive improvements across quality, yield, and cost.

The role spans from pathfinding through ramp to high-volume manufacturing with a strong emphasis on DOE, FA, and metrology knowledge. Qualified candidates bring 8+ years in semiconductor engineering (PhD: 5+ years), strong statistical analysis

Qualifications

Requires Bachelor/Master/PhD in engineering/material/mechanical/science with at least 8 years of relevant semiconductor industry experience (5 years for PhD).
Academic record of excellence in engineering/science.

Responsibilities

Develop SMT material and process for NBM new business model quality, reliability, cost, yield and manufacturing requirements.
Qualify new SMT materials and packaging processes for NPI programs; identify and mitigate interaction risks.
Prepare/update specifications for IC/package materials.
Plan and conduct experiments to characterize materials and processes from pathfinding to ramp.
Improve quality, reliability, cost, yield, process stability and safety using DOE and statistical tools.
Establish process control systems and support high volume manufacturing and new factory start-up.
Coordinate introduction of new package/material processes into production.
Perform package/material integrity analyses using DOE and FA/stat tools.