Senior Packaging Engineer — 2.5D/3D IC Packaging Lead

SanDisk; Batu Kawan; On-site; MYR 120,000 - 180,000; Full time

Job summary

SanDisk in Malaysia (Penang Batu Kawan, on-site) seeks a Senior Engineer, Packaging Engineering to lead packaging technology development and material roadmap execution for next‑gen memory storage solutions. You will partner with design, process, and lab teams to ensure robust, scalable packaging platforms and reliable performance in high‑volume production.

The role requires a strong background in semiconductor packaging, 2.5D/3D architectures, and a track record of delivering advanced packaging

Qualifications

• REQUIRED: Bachelor’s or Master’s degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline.

Responsibilities

• Key technology development & tech-staging role to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
• To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology.
• Lead and integrate assembly/test data pipeline, analyze and transform process data.
• In-depth fundamental investigation/characterization in packaging development.
• Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards.
• To co-drive material technology roadmap definition and path finding/development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products.
• To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities.
• Lead yield integration and detailed analysis activities in wafer level processing characterization and qualification phases.

Job description

SanDisk in Malaysia (Penang Batu Kawan, on-site) seeks a Senior Engineer, Packaging Engineering to lead packaging technology development and material roadmap execution for next‑gen memory storage solutions. You will partner with design, process, and lab teams to ensure robust, scalable packaging platforms and reliable performance in high‑volume production.

The role requires a strong background in semiconductor packaging, 2.5D/3D architectures, and a track record of delivering advanced packaging