Packaging Technology Engineer — AI/ML & 4IR

Sandisk; Simpang Ampat; On-site; MYR 90,000 - 150,000; Full time

Job summary

Sandisk in Penang, Malaysia seeks a packaging technology engineer to drive next generation memory packaging initiatives. You will integrate data pipelines, analyze process data, conduct experiments, and troubleshoot packaging issues to enable robust technology and efficient production.

The role requires a strong background in packaging development, data analysis, and collaboration with cross-functional teams to deliver AI-enabled solutions in a fast-paced manufacturing environment.

Qualifications

• Bachelor’s or Master’s degree in mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline.
• Min 3 years relevant working experience in engineering field.

Responsibilities

• Drive product, process and materials technology roadmap solutions for next generation memory storage packaging.
• Integrate assembly/test data pipeline, analyze and transform process data.
• In-depth fundamental investigation/characterization in packaging development.
• Design and conduct experiments to troubleshoot process issues and validate improvements.
• Drive in-depth engineering investigations and problem-solving in delivering robust packaging technology.
• Collaborate with process, equipment, factory automation and IT teams to deliver automation and AI solutions.

Skills

JMP

Packaging development

Data analysis

Teamwork

Communication

Education

Bachelor’s or Master’s in engineering

Tools

JMP

Job description

Sandisk in Penang, Malaysia seeks a packaging technology engineer to drive next generation memory packaging initiatives. You will integrate data pipelines, analyze process data, conduct experiments, and troubleshoot packaging issues to enable robust technology and efficient production.

The role requires a strong background in packaging development, data analysis, and collaboration with cross-functional teams to deliver AI-enabled solutions in a fast-paced manufacturing environment.