Senior Package Design Engineer: Power SiP & Flip-Chip

Renesas Electronics Corp.; Bayan Lepas; Presencial; MYR 100.000 - 180.000; Jornada completa

Descripción de la vacante

Renesas Electronics Corp. in Penang, Malaysia is seeking a packaging engineer to design and develop advanced power packaging solutions including Power SiP/modules, flip-chip LGA, and multi-chip modules.

You will collaborate with OSAT/CM partners to optimize processes, qualify new packages, and ensure smooth production transitions. The role requires 5–15 years in package development, strong knowledge of leadframe, laminates, QFN/SiP/module packaging, and wafer metallization, with proficiency in

Formación

• Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 5–15 years in package development emphasizing leadframe, laminate, QFN/SiP/module, flip-chip.
• Understanding of semiconductor power device package assembly processes, materials and technology.
• Knowledge of AutoCAD, Excel, PowerPoint, Word.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Responsabilidades

• Design and develop package and interconnect methods for Power SiP/modules, flip-chip LGA, MCM and power devices.
• Collaborate with OSAT/CM to run DOEs and set specifications.
• Work with Product Groups and Reliability teams to qualify new packages.
• Ensure smooth production transfer by resolving integration issues and implementing controls.
• Maintain expertise on advances in leadframe, power SiP/modules, and flip chip interconnects.
• Address customer complaints with Marketing, Quality and Operations to support growth.

Conocimientos

AutoCAD

Excel

PowerPoint

Word

Interpersonal skills

Analytical skills

Presentation skills

Educación

Physics, Chemistry, Mechanical, Electrical or Materials Engineering degree

Herramientas

SPC (Statistical Process Control)

Wafer metallization tooling

Descripción del empleo

Renesas Electronics Corp. in Penang, Malaysia is seeking a packaging engineer to design and develop advanced power packaging solutions including Power SiP/modules, flip-chip LGA, and multi-chip modules.

You will collaborate with OSAT/CM partners to optimize processes, qualify new packages, and ensure smooth production transitions. The role requires 5–15 years in package development, strong knowledge of leadframe, laminates, QFN/SiP/module packaging, and wafer metallization, with proficiency in