Staff Process Engineer: PQFN Packaging & NPI Lead

Aitomic Jobs

Ipoh

On-site

MYR 120,000 - 180,000

Full time

14 days+

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Job summary

Renesas Electronics in Malaysia is seeking a Staff Process Engineer to qualify and sustain Power QFN packaging and Cu Clip related thin die assembly processes. You will design packages and develop qualification methods for PQFN on SPS products, and ramp up manufacturing while securing sources.

The role requires hands-on experience in PQFN/QFN/WLCSP packaging, wire bonding, SPC analysis (JMP) and strong English communication.

Qualifications

Degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences.
Experience in process engineering or package development of thin wafer handling and SPS solder attach processes.
Knowledge in PQFN/QFN/WLCSP and leaded packages.
Knowledge of wire bonding.
Knowledge of SPC and JMP.

Responsibilities

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
Ramp up manufacturing volume and qualify required sources.
Improve assembly yield, capacity, quality and costs.
Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
Manage Product Lifecycle Management documents to the latest status.