Staff Process Engineer - Power QFN Packaging

Renesas Electronics Corp.; Subang Jaya; On-site; MYR 90,000 - 130,000; Full time

Job summary

Renesas Electronics Corp. is seeking a qualified engineer to advance assembly sustenance and process improvements for Power QFN and Cu Clip related thin die assembly processes in Subang Jaya, Malaysia.

The role emphasizes designing packages, developing qualification processes for PQFN in SPS products, ramping up manufacturing volume, and sustaining line throughput while driving yield, capacity, quality and cost improvements.

Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products and its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external cus... (truncated in source)

Job description

Renesas Electronics Corp. is seeking a qualified engineer to advance assembly sustenance and process improvements for Power QFN and Cu Clip related thin die assembly processes in Subang Jaya, Malaysia.

The role emphasizes designing packages, developing qualification processes for PQFN in SPS products, ramping up manufacturing volume, and sustaining line throughput while driving yield, capacity, quality and cost improvements.