Senior OSAT Project Manager — Power Module Packaging

Infineon Technologies AG; Ipoh; On-site; MYR 180,000 - 260,000; Full time

Job summary

Infineon Technologies AG is seeking a Senior Project Manager OSAT to drive package/process development with global partners and lead cross-functional teams across Europe, the US and Asia. You will steer projects from concept through high-volume production for next-generation Power Modules, PCB embedding and panel-level packaging.

The role requires strong technical background in advanced packaging, ownership of complex development programs, and effective international collaboration in a

Qualifications

• Master degree in Mechanical/Electrical/Materials/Physics or related field is required.
• PhD is a plus for preferred candidates.
• IPMA-C certification or equivalent is a plus.
• Minimum 7 years of experience in semiconductor technology or manufacturing and assembly.
• At least 5 years of experience in leading complex development projects.

Responsibilities

• Lead package/process development projects with Infineon BUs and global subcon partners, ensuring technology readiness for serial production.
• Focus on PCB embedding and Panel Level Packaging for next-gen Power Modules.
• Lead package innovation projects from definition to high-volume integration.
• Enable and release new subcontractors, package/technology platforms, and derivatives.
• Manage change initiatives affecting package, process, or subcontractors.
• Lead international, multidisciplinary teams across Europe, US, and Asia.

Skills

Self-motivation

Independent work

Cross-functional leadership

Team collaboration

Global/Multicultural teams

Strong communication (English/Chinese)

Education

Master degree in Mechanical/Electrical/Materials/Physics

PhD (plus)

IPMA-C certification or equivalent (plus)

Job description

Infineon Technologies AG is seeking a Senior Project Manager OSAT to drive package/process development with global partners and lead cross-functional teams across Europe, the US and Asia. You will steer projects from concept through high-volume production for next-generation Power Modules, PCB embedding and panel-level packaging.

The role requires strong technical background in advanced packaging, ownership of complex development programs, and effective international collaboration in a