Senior IC Packaging & HVM Engineering Lead

Renesas Electronics

Ipoh

On-site

MYR 180,000 - 280,000

Full time

40 hours ago

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Benefits offered by this job

Competitive benefits package

Job summary

Renesas Electronics in Ipoh, Malaysia seeks an experienced Senior Manager of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing for advanced packaging technologies. You will drive yield, process stability, and ramp readiness while liaising with Package Engineering, R&D, Quality, Supply Chain, and external OSAT partners.

The ideal candidate combines deep packaging expertise with data-driven problem solving and cross-functional

Qualifications

Bachelor’s degree or technical equivalent in engineering or related field.
15+ years of semiconductor packaging engineering experience with NPI-to-HVM exposure.
3+ years leading technical projects or teams in semiconductor environments.

Responsibilities

Lead manufacturing & sustaining engineering for semiconductor package assembly technologies.
Drive yield improvement, cycle time reduction, and cost optimization.
Ensure process controls, qualification requirements, and readiness across OSAT sites.
Coordinate with OSAT partners for transfers, scaling, and cost improvements.
Mentor and develop assembly engineering team capabilities.