Senior FOL Process Engineer – Die Attach & Wire Bond

ADI Resourcing

Ipoh

On-site

MYR 100,000 - 167,000

Full time

14 days+

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Job summary

ADI Resourcing is seeking a Senior FOL Process Engineer in Ipoh to sustain and optimize high-mix, high-volume electronics manufacturing processes. The role focuses on Die Attach and Wire Bond processes, data-driven reporting, and yield improvement.

The ideal candidate has a BS in Electronics or Electrical Engineering with at least 5 years in similar environments, strong problem-solving and SPC knowledge, and a hands-on attitude toward machine troubleshooting.

Qualifications

Bachelor of Science/Engineering, preferably Electronics or Electrical.
Minimum 5 years in high mix, high volume manufacturing environment.
Strong problem solving and data analysis capabilities.
Proficiency in JMP/Minitab and SPC methods.
Analytical mindset with hands-on troubleshoot skills.
Adaptable to rapid business changes and capable of leading a team.

Responsibilities

Sustain and improve Die Attach/Wire Bond processes.
Collect and analyze data to create engineering reports for new products and production.
Monitor and maintain assembly yield within KPI targets.
Lead improvements to reduce scrap from process excursions.
Evaluate test/yield data and defects to adjust process equipment.
Program, troubleshoot and maintain manufacturing equipment to meet yield targets.
Support evaluations of solders, epoxies, and new equipment and propose solutions.
Develop manufacturing work instructions and production routes with change orders where applicable.
Utilize SPC and risk management/FMEA in daily tasks.