Senior FOL Process Engineer (Ipoh)

ADI Resourcing

Ipoh

On-site

MYR 100,000 - 167,000

Full time

14 days+

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Job summary

ADI Resourcing is seeking a Senior FOL Process Engineer in Ipoh to sustain and optimize high-mix, high-volume electronics manufacturing processes. The role focuses on Die Attach and Wire Bond processes, data-driven reporting, and yield improvement.

The ideal candidate has a BS in Electronics or Electrical Engineering with at least 5 years in similar environments, strong problem-solving and SPC knowledge, and a hands-on attitude toward machine troubleshooting.

Qualifications

  • Bachelor of Science/Engineering, preferably Electronics or Electrical.
  • Minimum 5 years in high mix, high volume manufacturing environment.
  • Strong problem solving and data analysis capabilities.
  • Proficiency in JMP/Minitab and SPC methods.
  • Analytical mindset with hands-on troubleshoot skills.
  • Adaptable to rapid business changes and capable of leading a team.

Responsibilities

  • Sustain and improve Die Attach/Wire Bond processes.
  • Collect and analyze data to create engineering reports for new products and production.
  • Monitor and maintain assembly yield within KPI targets.
  • Lead improvements to reduce scrap from process excursions.
  • Evaluate test/yield data and defects to adjust process equipment.
  • Program, troubleshoot and maintain manufacturing equipment to meet yield targets.
  • Support evaluations of solders, epoxies, and new equipment and propose solutions.
  • Develop manufacturing work instructions and production routes with change orders where applicable.
  • Utilize SPC and risk management/FMEA in daily tasks.

Skills

Data analysis
Analytical thinking
Process troubleshooting
Team supervision
SPC knowledge
SAS JMP
Minitab
Adaptability

Education

Bachelor's degree in Electronics or Electrical Engineering

Tools

SAS JMP
Minitab
SPC

Job description

About the job Senior FOL Process Engineer (Ipoh)

JOB RESPONSIBILITIES:

  • Responsible for sustaining &improving the Die Attach / Wire Bond Process
  • Overall knowledge on electronicsmanufacturing and must be able to collect and analyze data in orderto create engineering reports for New products and regularproduction.
  • Monitor and maintain Assembly yieldwithin KPI target.
  • Key involvement in improving the systemsto bring down scrap rate due to process excursions.
  • Initiate process improvements througheffective evaluations of test/yield data and manufacturing defectsand make adjustments to process equipment accordingly.
  • Program, troubleshoot and maintainmanufacturing process equipment as required to meet the requiredyield target.
  • Support engineering initiatives inevaluating: solders, epoxies, new equipment (installations) andrecommend solutions both tactically and strategically.
  • Develop Manufacturing Work Instructionsand production routes along with Engineering change ordersimplementation when applicable.
  • Knowledgeable in SPC and RiskManagement/FMEA

JOB REQUIREMENTS:

  • Bachelor of Science/ Engineeringpreferably majoring in Electronics or Electrical.
  • Minimum 5 years working experienceworking in high mix and high volume manufacturing environment willbe an added advantage.
  • Good knowledge of process problemsolving analysis.
  • Good computer literacy and knowledgeablein SAS JMP, Minitab and SPC knowledge.
  • Must exhibit a strong sense ofanalytical skills with hands on working attitude on machinetroubleshooting will be an added advantage.
  • Adaptable and flexible to rapid changesto the business needs of the company.
  • Experience in supervising and leading ateam of process personnel.
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