Wire Bond Process Engineer | Semiconductor Assembly

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 60,000 - 110,000; Full time

Job summary

Carsem in Ipoh, Malaysia is seeking a Wire Bond Process Engineer to monitor bonding yield, identify root causes, and lead yield-improvement initiatives across production lines.

You will develop bonding recipes, run DOEs, collaborate with Quality, Production, Maintenance, and Engineering, and ensure documentation and customer communication.

Qualifications

• Bachelor's degree in Engineering (Electrical, Mechanical, Materials, or related field).
• Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.
• Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).
• Familiarity with bonding equipment and materials (Al wire, substrates).
• Good communication skills for customer interaction and reporting.

Responsibilities

• Monitor and analyze bonding yield and identify root causes of defects and yield loss.
• Lead yield improvement activities using structured problem solving (8D, FMEA, DOE).
• Establish and maintain process control parameters and ensure production compliance.
• Drive continuous yield improvement to meet internal targets and customer expectations.
• Develop and optimize bonding recipes (force, ultrasonic power, time, temperature).
• Improve process stability and robustness against material and environmental variations.
• Conduct DOE to validate changes and implement standardization across production lines.
• Study tool life, replacement frequency, and optimization; ensure machine performance and uptime.
• Respond to customer inquiries and provide data-supported reports; participate in audits.
• Prepare technical reports and yield analyses; ensure QMS compliance.

Skills

Wire bonding experience

Wedge bonding

Statistical analysis (SPC)

DOE

FMEA

Process troubleshooting

Cross-functional collaboration

Education

Bachelor's degree in Engineering (Electrical, Mechanical, Materials, or related)

Tools

Bonding equipment knowledge

SPC software

Job description

Wire Bond Process Engineer | Semiconductor Assembly

Monitor and analyze bonding yield, identifying root causes of defects and yield loss.

Lead yield improvement activities using structured problem-solving methodologies (e.g., 8D, FMEA, DOE).

Establish and maintain key process control parameters and ensure compliance in production.

Drive continuous yield improvement to meet internal targets and customer expectations.

2. Process Robustness & Improvement

Develop and optimize bonding recipes (force, ultrasonic power, time, temperature, etc.).

Improve process stability and robustness against material and environmental variations.

Conduct Design of Experiments (DOE) to validate process changes and improvements.

Implement process standardization and best practices across production lines.

3. Tooling & Equipment Management

Study and monitor bonding tool (capillary/wedge) life performance and wear-out mechanisms.

Define tool life criteria, replacement frequency, and optimization strategies.

Collaborate with equipment and maintenance teams to ensure machine performance and uptime.

Support equipment troubleshooting and qualification.

4. Customer Support & Technical Interface

Respond to customer inquiries, complaints, and technical requests in a timely manner.

Perform failure analysis and provide clear, data-supported reports to customers.

Participate in customer audits, technical reviews, and meetings as required.

Ensure alignment of process capability with customer specifications and requirements.

5. Documentation & Reporting

Maintain accurate process documentation, work instructions, and specifications.

Prepare technical reports, yield analysis, and improvement updates.

Ensure compliance with quality management systems and industry standards.

6. Cross-Functional Collaboration

Work closely with Quality, Production, Maintenance, and Engineering teams.

Provide technical training and guidance to operators and technicians.

Lead or participate in continuous improvement and cost-reduction initiatives. Ensure 5s implementation and enforcement.

TECHNICAL SKILLS & COMPETENCIES

Bachelor's degree in Engineering (Electrical, Mechanical, Materials, or related field).

Experience in semiconductor assembly, specifically wedge bonding or wire bonding processes.

Strong knowledge of statistical analysis and problem-solving tools (SPC, DOE, FMEA).

Familiarity with bonding equipment and materials (Al wire, substrates, etc.).

Good communication skills for customer interaction and reporting.

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, \