Semiconductor Package Design Engineer (Leadframe/Substrate)

Carsem; Ipoh; On-site; MYR 180,000 - 240,000; Full time

Job summary

Carsem Malaysia is seeking a seasoned Semiconductor Package Design Engineer (Leadframe/Substrate) to lead design, simulation, and rules development for advanced packaging. You will drive sub-micron precision in the power discrete segment, bridging CAD modeling, multiphysics simulations, and customer-facing technical support.

The role requires 7+ years in Leadframe & Substrate Design within Power Discrete packaging, with strong CAD/FEA skills and experience in GD&T, DFM/DFT, and

Qualifications

• Minimum 7+ years of hands-on Leadframe & Substrate Design in Power Discrete packaging.
• Experience with QFN/DFN/Clip-bond is preferred.
• CAD and simulation expertise required (SolidWorks, AutoCAD, Creo; Ansys/COMSOL).
• Strong GD&T, DFM/DFT, thermal and electrical modeling skills.

Responsibilities

• Lead 3D mechanical modeling and simulation of leadframes and substrates.
• Develop and apply GD&T for sub-micron precision components.
• Perform TMA and electrical parasitic modeling to evaluate high-power performance.
• Conduct FEA to mitigate design risks.
• Lead design reviews and engage with customers and partners.

Skills

Leadframe design

Substrate design

Power discrete packaging

GD&T

FEA / multiphysics

Thermal/electrical modeling

DFM / DFT

Customer-facing communication

Tools

SolidWorks

AutoCAD

Creo

Ansys

COMSOL

Job description

Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.

We are seeking a seasoned Semiconductor Package Design Engineer (Leadframe/Substrate) to lead the design, simulation, and rules development for advanced semiconductor packaging.

In this role, you will drive sub-micron precision packaging solutions in the power discrete segment (expanding beyond traditional QFNs into advanced power modules). You will bridge the gap between initial CAD modeling, multiphysics simulations, DFM rules, and customer-facing technical support.

Key Responsibilities

1. Design & Multiphysics Simulation

Lead 3D mechanical modeling, design, and simulation of leadframes and substrates using industry-standard CAD tools to support progressive stamping die creation.

Apply Geometric Dimensioning and Tolerancing (GD&T) to ensure sub-micron precision for critical power and thermal packaging components.

Perform Thermal Mechanical Analysis (TMA) and Electrical Parasitic Modeling/Simulations to evaluate high-power performance.

Conduct robust Finite Element Analysis (FEA) simulations to mitigate early-stage design risks (stress, warpage, thermal management).

2. Process & Design Rules Development

Establish and update internal design rules based on customer specifications and packaging assembly process capabilities.

Systematically incorporate Design for Manufacturability (DFM) and Design for Testing (DFT) principles into early design phases.

Apply knowledge of stamped and etched leadframe tooling specifications and manufacturing methodologies.

3. Analysis, Reliability & Standards

Perform worst-case tolerance stack-up analysis, DFMEA, and reliability risk assessments.

Ensure all designs meet strict cost, thermal, electrical performance, and international industry standards/regulations.

Stay ahead of emerging semiconductor packaging technologies, materials, and power discrete industry trends.

4. Cross-Functional Leadership & Customer Engagement

Collaborate closely with internal cross-functional teams, including Assembly Process Engineering, Mechanical Engineering, Quality Assurance, and Tooling vendors.

Lead technical design reviews and directly engage with key customers and external technical partners throughout project development.

Requirements

Experience: Minimum 7+ years of hands‑on experience in Leadframe & Substrate Design, specifically within the Power Discrete segment (QFN, DFN, Clip‑bond, etc.).

Specialized Experience: Exposure to Power Module Design is a strong added advantage.

CAD & Simulation Tools: Expertise in high‑end CAD software (e.g., SolidWorks, AutoCAD, Creo) and FEA/multiphysics simulation suites (e.g., Ansys, COMSOL).

Technical Mastery: Deep proficiency in GD&T, DFM/DFT, thermal/electrical modeling, and tolerance analysis.

Fabrication Knowledge: Strong understanding of sheet metal fabrication, precision stamping, etching, welding, and riveting techniques.

Communication: Excellent technical communication skills with a proven track record in customer‑facing technical reviews.