Leadframe & Substrate Design Engineer - Power Discrete

Carsem; Ipoh; On-site; MYR 180,000 - 240,000; Full time

Job summary

Carsem Malaysia is seeking a seasoned Semiconductor Package Design Engineer (Leadframe/Substrate) to lead design, simulation, and rules development for advanced packaging. You will drive sub-micron precision in the power discrete segment, bridging CAD modeling, multiphysics simulations, and customer-facing technical support.

The role requires 7+ years in Leadframe & Substrate Design within Power Discrete packaging, with strong CAD/FEA skills and experience in GD&T, DFM/DFT, and

Qualifications

• Minimum 7+ years of hands-on Leadframe & Substrate Design in Power Discrete packaging.
• Experience with QFN/DFN/Clip-bond is preferred.
• CAD and simulation expertise required (SolidWorks, AutoCAD, Creo; Ansys/COMSOL).
• Strong GD&T, DFM/DFT, thermal and electrical modeling skills.

Responsibilities

• Lead 3D mechanical modeling and simulation of leadframes and substrates.
• Develop and apply GD&T for sub-micron precision components.
• Perform TMA and electrical parasitic modeling to evaluate high-power performance.
• Conduct FEA to mitigate design risks.
• Lead design reviews and engage with customers and partners.

Skills

Leadframe design

Substrate design

Power discrete packaging

GD&T

FEA / multiphysics

Thermal/electrical modeling

DFM / DFT

Customer-facing communication

Tools

SolidWorks

AutoCAD

Creo

Ansys

COMSOL

Job description

Carsem Malaysia is seeking a seasoned Semiconductor Package Design Engineer (Leadframe/Substrate) to lead design, simulation, and rules development for advanced packaging. You will drive sub-micron precision in the power discrete segment, bridging CAD modeling, multiphysics simulations, and customer-facing technical support.

The role requires 7+ years in Leadframe & Substrate Design within Power Discrete packaging, with strong CAD/FEA skills and experience in GD&T, DFM/DFT, and