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Jora Malaysia is seeking a Lead Engineer, Manufacturing Process for PCB Assembly operations. You will optimize production data, manage routings in SAP and Spectrum Pro, and prepare detailed assembly instructions while coordinating with cross‑functional teams to ensure quality output.
With 8–10 years in EMS, you will drive NPI and DFMs, oversee product changes, and lead the design and fabrication of jigs and fixtures to sustain high standards of reliability and efficiency.
Jora Malaysia will close on 9th September 2026. Thank you for being with us, we are cheering you on as you continue your career journey.
Lead Engineer, Manufacturing Process role focused on PCB Assembly operations. The position involves optimizing production data, managing manufacturing processes, and overseeing new product launches while collaborating with cross‑functional teams to ensure efficient and high‑quality output.
Prepare and optimize production data for PCB Assembly, ensuring efficient and high‑quality output
Create and maintain detailed production routings in SAP and Spectrum Pro (SP2), optimizing the material and product flow
Develop clear and concise PCB assembly instructions, considering the requirements and capabilities of the production
Manage stencil optimization and inventory, ensuring timely delivery and optimal use
Oversee the launch of new products, creating all necessary documentation and coordinating with cross‑functional teams
Manage product changes and version control, ensuring all relevant parties are informed
Collaborate closely with production and product development teams, providing technical expertise and support
Prepare NPI for new models and Design for Manufacturing (DFM)
Prevent and eliminate process defects and maintain quality levels
Design and fabricate jig and fixtures and register into system
Degree in Electrical/Electronics/Mechanical Engineering
8-10 years of working experience in EMS environment
Trained and understand ISO working procedures
Familiar with engineering documentation BOM/ECN implementation
In‑depth knowledge and understanding of the design process for systems and printed circuit boards, subassemblies, or other related company products
In‑depth knowledge of manufacturing processes and equipment used for systems and printed circuit boards and subassemblies
In‑depth knowledge of industry and quality standards and SPC methodologies
In‑depth knowledge of materials and components used in the construction of systems and printed circuit boards and subassemblies
3-5 years people management skills with systematic job load assignments to subordinates