Senior Packaging Development Engineer

Monolithic Power Malaysia Sdn Bhd; George Town; On-site; MYR 100,000 - 167,000; Full time

Benefits offered by this job

Supportive work environment

Career development opportunities

Job summary

Monolithic Power Malaysia Sdn Bhd in George Town, Penang seeks a packaging design engineer to translate system requirements into robust package definitions. You will use simulation tools to meet electrical, thermal and mechanical specs and collaborate with internal teams, subcontractors and suppliers on new packages and processes.

Candidates should have a BS/MS in engineering and 3+ years in packaging design, with proficiency in AutoCAD/SolidWorks.

Qualifications

• BS or MS in Mechanical, Materials Science, Electrical Engineering, or related field.
• Minimum 3 years in design of packages and modules.
• Proficiency in CAD tools
• Deep understanding of packaging tech, process, materials and manufacturing implementation.
• Knowledge of thermal, electrical and mechanical simulation (FEA/CFD).
• Experience with ANSYS Icepak, Q3D or Mechanical preferred.
• Excellent writing, communication and presentation skills.

Responsibilities

• Interact with cross-functional teams, subcontractors and suppliers to develop new packages and assembly processes.
• Optimize materials and processes to maximize yield and reliability while minimizing cost.
• Benchmark competitors and develop new methodologies, tech, and IP.
• Provide direct support for multiple product lines and customers.

Skills

3+ years packaging design

System level simulation

Cross-functional collaboration

Communication skills

Innovation mindset

Education

Engineering degree (Mechanical, Materials, EE)

Tools

AutoCAD

SolidWorks

ANSYS Icepak

Q3D

Mechanical

Job description

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Monolithic Power Malaysia Sdn Bhd – George Town, Penang

Design, develop and scale to volume production of new packages and modules for the industrial, automotive, renewable and telecom markets.

The candidate can understand system requirements and build these into the definition of the package/power module to meet electrical, thermal, and mechanical specifications.

Capabilities to independently use simulation software.

Interact with internal cross-function teams, subcontractors and material suppliers to develop new packages, assembly processes and technologies.

Optimize the assembly materials and processes with best package performance & reliability, maximize manufacturing yield, and minimize assembly cost.

Benchmark the competitions in package design, assembly materials and assembly processes, and create a new methodology, technology and intellectual property.

Direct support for multiple product lines and customers.

REQUIREMENTS:

BS or MS degree in Mechanical, Material Science, Electrical Engineering or related engineering degree.

3+ years of experience in design of packages and modules.

Proficiency in CAD software: Auto CAD and SolidWorks preferred.

Deep understanding in various packaging technologies, process flow, material, qualification and manufacturing implementation.

Knowledge of thermal, electrical and mechanical finite FEA/CFD simulation software tools and simulation methods used for semiconductor packaging and board level applications.

ANSYS Icepak/Q3D/Mechanical Preferred.

System level simulation skill is a plus.

Excellent communication, writing and presentation skills.

Strong innovation, problem solving mindset.

• Supportive work environment where your ideas count, and you can thrive in a diverse culture.
• World of opportunities for your personal and professional development.