Process - Equipment Engineer – Dicing - Asymentek (Semiconductor Manufacturing)

Globetronics Technology Berhad; Bayan Lepas; On-site; MYR 67,000 - 112,000; Full time

Job summary

Globetronics Technology Berhad is seeking a Process & Equipment Engineer with hands-on experience in semiconductor dicing/sawing and Asymentek dispensing equipment. The role focuses on process development, optimization, troubleshooting, qualification, yield improvement, and continuous improvement across dicing and dispensing/encapsulation processes.

The candidate will set up, program, and optimize Asymentek dispensing equipment, recipes, and parameters; optimize dicing conditions; troubleshoot

Qualifications

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or related field.
• 2–5 years of relevant experience in semiconductor, electronics, or precision manufacturing.
• Hands-on experience in semiconductor dicing/sawing processes.
• Experience with Asymentek dispensing equipment is highly preferred.
• Strong analytical, problem-solving, and teamwork skills.

Responsibilities

• Develop, optimize, and sustain dicing/sawing and Asymentek dispensing processes.
• Set up and optimize Asymentek dispensing equipment, recipes, and process parameters.
• Analyze defects such as die chipping, cracking, delamination, and voids.
• Drive improvements in yield, quality, productivity, and cycle time.
• Support NPI, product qualification, engineering builds, and product transfer.
• Conduct process qualification, validation, DOE, and capability studies.
• Monitor SPC and process trends; implement corrective/preventive actions.
• Collaborate with Production, QA, Equipment Eng, and NPI teams.

Skills

Analytical thinking

Problem-solving

Communication

Teamwork

Independent worker

Education

Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, Manufacturing Engineering

Tools

Asymentek dispensing equipment

Dicing/sawing equipment

Job description

Process - Equipment Engineer - Dicing - Asymentek (Semiconductor Manufacturing)

Process & Equipment Engineer - Dicing & Asymentek | Semiconductor Manufacturing

Job Summary

We are seeking an experienced Process & Equipment Engineer with hands-on experience in semiconductor dicing/sawing and Asymentek dispensing equipment. The successful candidate will be responsible for process development, optimization, troubleshooting, qualification, yield improvement, and continuous improvement across dicing and dispensing/encapsulation processes.

Key Responsibilities

• Develop, optimize, and sustain dicing/sawing and Asymentek dispensing processes.
• Set up, program, and optimize Asymentek dispensing equipment, recipes, and process parameters.
• Optimize dicing parameters including blade selection, spindle speed, feed rate, cutting depth, and process conditions.
• Troubleshoot process and equipment issues related to dicing, dispensing, and encapsulation.
• Analyze defects such as die chipping, cracking, delamination, voids, dispensing variation, and misalignment.
• Drive improvements in yield, quality, productivity, process capability, and cycle time.
• Support NPI, product qualification, engineering builds, and product transfer.
• Conduct process qualification, validation, DOE, capability studies, and process characterization.
• Monitor SPC and process trends and implement corrective/preventive actions.
• Work closely with Production, QA, Equipment Engineering, and NPI teams to resolve manufacturing issues.
• Prepare and maintain SOPs, work instructions, process specifications, control plans, and PFMEA.
• Conduct RCA, 8D, CAPA and continuous improvement activities.
• Support equipment installation, qualification, preventive maintenance, and troubleshooting.
• Ensure compliance with semiconductor quality, safety, ESD, and manufacturing requirements.

Requirements

• Bachelor’s Degree in Mechanical, Electrical, Electronics, Mechatronics, Manufacturing Engineering or related field.
• 2-5 years of relevant experience in semiconductor, electronics, or precision manufacturing.
• Hands-on experience in semiconductor dicing/sawing processes.
• Experience with Asymentek dispensing equipment is highly preferred.
• Knowledge of dispensing, underfill, encapsulation, epoxy, or adhesive processes.
• Good understanding of wafer/die handling and semiconductor backend processes.
• Experience in process optimization, troubleshooting, qualification, and yield improvement.
• Familiar with SPC, DOE, PFMEA, RCA, 8D and CAPA.
• Strong analytical, problem-solving, communication, and teamwork skills.
• Able to work independently in a fast-paced manufacturing environment.

Preferred Technical Skills / Keywords

Dicing | Sawing | Wafer Dicing | Die Sawing | Asymentek | Asymentek Dispensing | Dispensing | Epoxy Dispensing | Underfill | Encapsulation | Die Attach | Semiconductor Assembly | Process Engineering | Process Development | Process Optimization | Yield Improvement | NPI | Process Qualification | SPC | DOE | PFMEA | RCA | 8D | CAPA

Added Advantage

Experience in the following will be an advantage:

• Underfill and encapsulation processes
• Dam & fill / glob top
• Die attach and wafer processing
• Blade selection and dicing parameter optimization
• Vision alignment and inspection
• Curing process
• Equipment programming and troubleshooting