Process - Equipment Technician – Assembly - Dicing - Pick - Place-Underfill-Encapsulation

Globetronics Technology Berhad; Bayan Lepas; On-site; MYR 42,000 - 60,000; Full time

Job summary

Globetronics Technology Berhad in Malaysia is seeking an experienced Semiconductor Assembly & Process Technician to support daily production, equipment setup, and process improvements. The role covers Pick & Place, Dicing, FOL assembly, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.

You will work in a cleanroom environment and participate in yield and productivity improvements while collaborating with QA, Process Engineering, and

Qualifications

• Diploma/Certificate in Engineering or a related field.
• 1–5 years hands-on experience in semiconductor or electronics manufacturing.
• Hands-on experience with Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.
• Willing to work in a cleanroom and shift environment.

Responsibilities

• Operate, set up, and monitor assembly and manufacturing equipment per SOPs and work instructions.
• Perform hands-on processes including Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.
• Support Front-of-Line (FOL) assembly processes and ensure production targets and quality requirements are met.
• Conduct equipment setup, product changeover, recipe verification, and parameter checks.
• Troubleshoot process and equipment abnormalities and escalate to Engineers when needed.
• Maintain accurate production, process, and equipment records.

Skills

Teamwork

Problem solving

Attention to detail

Cleanroom experience

Shift work

Education

SPM / Certificate / Diploma in Engineering/ Electronics/ Mechatronics/ Manufacturing

Tools

Pick & Place

Dicing

Wafer Sawing

FOL

Die Bonder

Die Attach

DA & Recon

Curing

Plasma

Dispensing

Underfill

PCB Mounter

Encapsulation

Asymtek

Job description

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Process - Equipment Technician - Assembly - Dicing - Pick - Place-Underfill-Encapsulation

Semiconductor Assembly & Process Technician - FOL / Dicing / Encapsulation

Job Summary

We are seeking an experienced Semiconductor Assembly & Process Technician with hands‑on experience in Pick & Place, Dicing, FOL Assembly, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation processes. The successful candidate will support daily production, equipment setup, process troubleshooting, product changeover, and process improvement to ensure stable and efficient semiconductor manufacturing operations.

Key Responsibilities

• Operate, set up, and monitor semiconductor assembly and manufacturing equipment according to SOPs and work instructions.
• Perform hands‑on processes including Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.
• Support FOL (Front‑of‑Line) assembly processes and ensure production targets and quality requirements are achieved.
• Perform equipment setup, product changeover, recipe verification, and parameter checks.
• Troubleshoot process and equipment abnormalities and elevate issues to Engineers when required.
• Perform basic equipment adjustments and support preventive maintenance activities.
• Monitor process parameters, machine performance, product quality, and production output.
• Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly‑related issues.
• Support engineering trials, NPI, process qualification, product transfer, and improvement activities.
• Maintain accurate production, process, and equipment records.
• Work closely with Production, Process Engineering, Equipment Engineering, and QA teams to resolve production issues.
• Support yield improvement, productivity improvement, 5S, Lean, and continuous improvement activities.
• Ensure compliance with safety, ESD, cleanroom, quality, and company requirements.

Required Skills & Experience

• Minimum SPM / Certificate / Diploma in Engineering, Electronics, Mechanical, Mechatronics, Manufacturing, or related field.
• 1-5 years of hands‑on experience in semiconductor, electronics, or manufacturing industry.
• Practical experience in one or more of the following processes:
• Pick & Place
• Dicing / Wafer Sawing
• DA & Recon
• Curing / Cure
• Plasma
• Dispensing
• Underfill
• PCB Mounter
• Encapsulation
• Experience with Asymtek / Asymementek dispensing or encapsulation equipment is an added advantage.
• Good understanding of semiconductor assembly processes and equipment operation.
• Able to perform basic machine troubleshooting and process adjustments.
• Willing to work in a cleanroom and shift environment.
• Good teamwork, discipline, attention to detail, and problem‑solving skills.

Preferred Technical Skills / Keywords

Pick & Place | Dicing | Wafer Sawing | FOL | Die Bonder | Die Attach | DA & Recon | Curing | Plasma | Dispensing | Wire Bonder | Underfill | PCB Mounter | Encapsulation | Asymtek | Semiconductor Assembly | Backend Semiconductor | Process Technician | Equipment Technician | Machine Setup | Machine Troubleshooting | Recipe Setup | Preventive Maintenance | Yield Improvement | ESD | Cleanroom | 5S

Added Advantage

Candidates with hands‑on experience in multiple semiconductor assembly processes will be highly preferred, particularly those with experience across FOL, Dicing, Die Attach, Wire Bonding, Underfill, PCB Mounting, and Encapsulation.