Semiconductor Assembly & Process Technician – FOL / Dicing / Encapsulation

Globetronics Technology Berhad; Bayan Lepas; On-site; MYR 39,000 - 67,000; Full time

Job summary

Globetronics Technology Berhad in Malaysia is hiring a Semiconductor Assembly & Process Technician with hands-on experience in Pick & Place, Dicing, FOL Assembly, Die Bonder, and Encapsulation. The role supports daily production, equipment setup, process troubleshooting and changeovers to keep semiconductor manufacturing operations stable and efficient.

You will operate and monitor equipment per SOPs, assist in NPI, process qualification and product transfers, perform troubleshooting, and

Qualifications

• Minimum SPM/Certificate/Diploma in Engineering or related field.

Responsibilities

• Operate, set up and monitor assembly and manufacturing equipment per SOPs and work instructions.
• Perform Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.
• Support FOL assembly processes and ensure production targets and quality requirements are achieved.
• Perform equipment setup, product changeover, recipe verification, and parameter checks.
• Troubleshoot process and equipment abnormalities and escalate issues to Engineers when required.
• Perform basic equipment adjustments and support preventive maintenance activities.
• Monitor process parameters, machine performance, product quality, and production output.
• Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly-related issues.
• Support engineering trials, NPI, process qualification, product transfer, and improvement activities.
• Maintain accurate production, process, and equipment records.

Skills

Process troubleshooting

Equipment setup

QA & process control

Documentation

Team collaboration

Education

SPM / Certificate / Diploma in Engineering or related field

Tools

Pick & Place

Dicing

FOL Assembly

Die Bonder

DA & Recon

Curing

Plasma

Dispensing

Wire Bonder

Underfill

PCB Mounter

Encapsulation

Asymtek equipment

Job description

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Semiconductor Assembly & Process Technician – FOL / Dicing / Encapsulation

We are seeking an experienced Semiconductor Assembly & Process Technician with hands‑on experience in Pick & Place, Dicing, FOL Assembly, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation processes. The successful candidate will support daily production, equipment setup, process troubleshooting, product changeover, and process improvement to ensure stable and efficient semiconductor manufacturing operations.

Key responsibilities

Operate, set up, and monitor semiconductor assembly and manufacturing equipment according to SOPs and work instructions.

Perform hands‑on processes including Pick & Place, Dicing, Die Bonder, DA & Recon, Curing, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, and Encapsulation.

Support FOL (Front-of-Line) assembly processes and ensure production targets and quality requirements are achieved.

Perform equipment setup, product changeover, recipe verification, and parameter checks.

Troubleshoot process and equipment abnormalities and **escalate** issues to Engineers when required.

Perform basic equipment adjustments and support preventive maintenance activities.

Monitor process parameters, machine performance, product quality, and production output.

Conduct visual inspection and identify defects such as die misalignment, wire defects, voids, delamination, dispensing defects, and assembly‑related issues.

Support engineering trials, NPI, process qualification, product transfer, and improvement activities.

Maintain accurate production, process, and equipment records.

About you

Minimum SPM / Certificate / Diploma in Engineering, Electronics, Mechanical, Mechatronics, Manufacturing, or related field.

1–5 years of hands‑on experience in semiconductor, electronics, or manufacturing industry.

Practical experience in one or more of the following processes: Pick & Place, Dicing / Wafer Sawing, FOL Assembly, Die Bonder, DA & Recon, Curing / Cure, Plasma, Dispensing, Wire Bonder, Underfill, PCB Mounter, Encapsulation.

Experience with Asymtek / dispensing or encapsulation equipment is an added advantage.

Good understanding of semiconductor assembly processes and equipment operation.

Able to perform basic machine troubleshooting and process adjustments.

Willing to work in a cleanroom and shift environment.

Good teamwork, discipline, attention to detail, and problem‑solving skills.