Dicing & Dispensing Equipment Engineer (Semiconductor)

Globetronics Technology Berhad; Bayan Lepas; On-site; MYR 67,000 - 112,000; Full time

Job summary

Globetronics Technology Berhad is seeking a Process & Equipment Engineer with hands-on experience in semiconductor dicing/sawing and Asymentek dispensing equipment. The role focuses on process development, optimization, troubleshooting, qualification, yield improvement, and continuous improvement across dicing and dispensing/encapsulation processes.

The candidate will set up, program, and optimize Asymentek dispensing equipment, recipes, and parameters; optimize dicing conditions; troubleshoot

Qualifications

• Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, or related field.
• 2–5 years of relevant experience in semiconductor, electronics, or precision manufacturing.
• Hands-on experience in semiconductor dicing/sawing processes.
• Experience with Asymentek dispensing equipment is highly preferred.
• Strong analytical, problem-solving, and teamwork skills.

Responsibilities

• Develop, optimize, and sustain dicing/sawing and Asymentek dispensing processes.
• Set up and optimize Asymentek dispensing equipment, recipes, and process parameters.
• Analyze defects such as die chipping, cracking, delamination, and voids.
• Drive improvements in yield, quality, productivity, and cycle time.
• Support NPI, product qualification, engineering builds, and product transfer.
• Conduct process qualification, validation, DOE, and capability studies.
• Monitor SPC and process trends; implement corrective/preventive actions.
• Collaborate with Production, QA, Equipment Eng, and NPI teams.

Skills

Analytical thinking

Problem-solving

Communication

Teamwork

Independent worker

Education

Bachelor’s degree in Mechanical, Electrical, Electronics, Mechatronics, Manufacturing Engineering

Tools

Asymentek dispensing equipment

Dicing/sawing equipment

Job description

Globetronics Technology Berhad is seeking a Process & Equipment Engineer with hands-on experience in semiconductor dicing/sawing and Asymentek dispensing equipment. The role focuses on process development, optimization, troubleshooting, qualification, yield improvement, and continuous improvement across dicing and dispensing/encapsulation processes.

The candidate will set up, program, and optimize Asymentek dispensing equipment, recipes, and parameters; optimize dicing conditions; troubleshoot