Equipment - Process Engineer – Sawing - Mounter (Condux-Takatori)

Globetronics Technology Berhad; Bayan Lepas; On-site; MYR 100,000 - 145,000; Full time

Job summary

Globetronics Technology Berhad is seeking an experienced Equipment & Process Engineer focused on Sawing and Mounter processes. The role involves hands-on development, optimization, and qualification of Condux/Takatori equipment to ensure stable semiconductor manufacturing operations.

You will drive process improvements, troubleshoot equipment issues, and collaborate with Production, QA, and NPI teams to support new product introductions and transfers.

Qualifications

• Bachelor's degree in Electrical, Electronics, Mechanical, Mechatronics or Manufacturing Engineering.
• 2-5 years of semiconductor/electronics/precision manufacturing experience.
• Hands-on with semiconductor sawing/dicing processes and Condux/Takatori mounter equipment.

Responsibilities

• Develop, optimize, and sustain semiconductor sawing and mounter processes.
• Support and optimize Condux/Takatori mounter equipment and process parameters.
• Set up, qualify, and optimize sawing/mounting recipes for new and existing products.
• Troubleshoot process and equipment-related issues and implement corrective actions.
• Monitor and improve yield, quality, productivity, cycle time, and process capability.
• Analyze defects such as die chipping, cracking, kerf variation, misalignment, die damage and mounting issues.
• Conduct process qualification, validation, capability studies, and engineering evaluations.
• Support NPI, product transfer, engineering builds, and new equipment introduction.
• Work with Production, Equipment, QA, and NPI teams to resolve issues.
• Develop and maintain process specs, SOPs, and control plans.

Skills

SPC

DOE

PFMEA

RCA

8D

CAPA

Analytical

Problem-solving

Teamwork

Communication

Education

Bachelor's degree in Electrical/Electronics/Mechanical/Mechatronics/Manufacturing Engineering

Tools

Condux mounter

Takatori mounter

Wafer dicing

Sawing equipment

Job description

Equipment - Process Engineer - Sawing - Mounter (Condux-Takatori)

Equipment & Process Engineer - Sawing & Mounter (Condux/Takatori)

Job Summary

We are seeking an experienced Equipment & Process Engineer - Sawing & Mounter with hands-on experience in Condux/Takatori mounter and semiconductor sawing processes. The successful candidate will be responsible for process development, optimization, troubleshooting, equipment qualification, yield improvement, and continuous improvement to ensure stable and efficient semiconductor manufacturing operations.

Key Responsibilities

• Develop, optimize, and sustain semiconductor sawing and mounter processes.
• Support and optimize Condux/Takatori mounter equipment and related process parameters.
• Set up, qualify, and optimize sawing/mounting recipes for new and existing products.
• Troubleshoot process and equipment-related issues and implement corrective actions.
• Monitor and improve yield, quality, productivity, cycle time, and process capability.
• Analyze sawing and mounting defects such as die chipping, cracking, kerf variation, misalignment, die damage, and mounting issues.
• Conduct process qualification, validation, capability studies, and engineering evaluations.
• Support NPI, product transfer, engineering builds, and new equipment introduction.
• Work closely with Production, Equipment, QA, and NPI teams to resolve manufacturing issues.
• Develop and maintain process specifications, SOPs, work instructions, control plans, and process documentation.
• Apply SPC, DOE, PFMEA, RCA, 8D and CAPA for process improvement.
• Drive continuous improvement, cost reduction, cycle-time improvement, and process stability initiatives.
• Support preventive maintenance, equipment calibration, and equipment performance improvement.
• Ensure compliance with quality, safety, ESD, and semiconductor manufacturing requirements.

Requirements

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering or related field.
• 2-5 years of experience in semiconductor, electronics, or precision manufacturing.
• Hands-on experience with semiconductor sawing/dicing processes.
• Experience with Condux and/or Takatori mounter equipment is highly preferred.
• Good understanding of wafer/die handling and mounting processes.
• Experience in process troubleshooting, optimization, qualification, and yield improvement.
• Knowledge of semiconductor backend manufacturing processes.
• Familiar with SPC, DOE, PFMEA, RCA, 8D and CAPA.
• Strong analytical, problem-solving, communication, and teamwork skills.
• Able to work independently and support production requirements in a fast-paced manufacturing environment.

Preferred Technical Skills / Keywords

Added Advantage

Experience in any of the following will be an advantage:

• Wafer sawing / dicing
• Wafer mounting and tape mounting
• Vision alignment and inspection
• Blade selection and optimization
• Sawing parameter optimization
• Semiconductor backend assembly processes
• Equipment programming and troubleshooting