Process / Equipment Engineer – PM/CAL, AOI, Sawing, Dicing & Encapsulation

Globetronics Sdn. Bhd.; Bayan Lepas; On-site; MYR 89,000 - 134,000; Full time

Job summary

Globetronics Sdn. Bhd. in Penang invites a Process & Equipment Engineer to optimize PM/CAL, AOI/SBJ, and Encapsulation across semiconductor lines. You will drive reliability, yield, and process improvements through hands-on equipment management and data-driven troubleshooting.

The ideal candidate has a Bachelor’s in engineering and 2–5 years’ relevant experience, with strong problem-solving, cross-functional collaboration, and the ability to work in a fast-paced semiconductor environment.

Qualifications

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering or related field.
• 2–5 years of relevant experience in semiconductor, electronics, precision manufacturing, or related industries.
• Hands-on experience with semiconductor manufacturing equipment and processes.
• Strong experience in PM/CAL and equipment troubleshooting.
• Knowledge of SPC, DOE, PFMEA, RCA, 8D, CAPA, OEE and equipment reliability.

Responsibilities

• Support and sustain semiconductor manufacturing processes and equipment to achieve stable production, quality, yield, and productivity.
• Plan, execute, and monitor PM and CAL activities.
• Monitor equipment performance, downtime, reliability, and maintenance trends.
• Troubleshoot equipment and process abnormalities and perform RCA and corrective actions.
• Support AOI/SBJ process setup, programming, recipe optimization, inspection, and defect analysis.
• Develop and optimize Dispensing and Laser Marking processes and parameters.
• Support Condux/Takatori Sawing processes, including equipment setup and troubleshooting.
• Support 3D Laser Printer/AOI process setup, inspection parameters, and recipe development.
• Develop, optimize and sustain Encapsulation processes and equipment.
• Support Dicing / Wafer Sawing process development, qualification, and yield improvement.

Skills

PM/CAL experience

Equipment troubleshooting

Education

Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering

Tools

AOI/SBJ

Condux/Takatori Sawing

3D Laser Printer/AOI

Encapsulation

Job description

Process / Equipment Engineer – PM/CAL, AOI, Sawing, Dicing & Encapsulation

We are seeking an experienced Process & Equipment Engineer with hands-on experience in semiconductor manufacturing processes and equipment, particularly Preventive Maintenance & Calibration (PM/CAL), AOI/SBJ, Dispensing & Laser Marking, Condux/Takatori Sawing, 3D Laser Printer/AOI, Encapsulation, and Dicing. The successful candidate will be responsible for equipment reliability, process optimization, troubleshooting, qualification, yield improvement, and continuous improvement across semiconductor manufacturing operations.

Key responsibilities

Support and sustain semiconductor manufacturing processes and equipment to achieve stable production, quality, yield, and productivity.

Plan, execute, and monitor Preventive Maintenance (PM) and Calibration (CAL) activities.

Monitor equipment performance, downtime, reliability, and maintenance trends.

Troubleshoot equipment and process abnormalities and perform Root Cause Analysis (RCA) and corrective actions.

Support AOI/SBJ process setup, programming, recipe optimization, inspection, and defect analysis.

Develop and optimize Dispensing and Laser Marking processes and parameters.

Support Condux/Takatori Sawing processes, including equipment setup, recipe optimization, troubleshooting, and process improvement.

Support 3D Laser Printer/AOI process setup, inspection parameters, recipe development, and optimization.

Develop, optimize, and sustain Encapsulation processes and equipment.

Support Dicing / Wafer Sawing process development, qualification, and yield improvement.

About you

Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering or related field.

2–5 years of relevant experience in semiconductor, electronics, precision manufacturing, or related industries.

Hands-on experience with semiconductor manufacturing equipment and processes.

Strong experience in PM/CAL and equipment troubleshooting.

Experience in one or more of the following is required: AOI, SBJ, Dispensing, Laser Marking, Sawing, Dicing, 3D Laser Printer, or Encapsulation.

Knowledge of SPC, DOE, PFMEA, RCA, 8D, CAPA, OEE, and equipment reliability.

Strong analytical, troubleshooting, and problem-solving skills.

Good communication and cross-functional teamwork skills.

Able to work independently in a fast-paced semiconductor manufacturing environment.