Die Bond Process Engineer - Yield & NPI Impact

NXP Semiconductors

Kuala Lumpur

On-site

MYR 90,000 - 130,000

Full time

2 days ago

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Job summary

NXP Semiconductors Malaysia is seeking an Assembly Die Bond Engineer to develop, optimize, and sustain die bonding processes in semiconductor assembly, driving quality, yield, cycle-time reduction, and cost efficiency while supporting NPI and continuous improvement initiatives.

The role focuses on process development, daily production support, and maintaining robust documentation and compliance across projects. A strong engineering background in semiconductor die bonding is required.

Qualifications

Bachelor/Master in related engineering major with semiconductor experience in Die bond.

Responsibilities

Develop, qualify, and optimize die bonding processes for semiconductor packages.
Establish process parameters and operating specifications.
Perform process characterization and verification activities.
Support new package development and technology transfers.
Provide daily engineering support to manufacturing operations.
Troubleshoot die bond-process related issues.
Analyze yield losses and process excursions.
Implement corrective and preventive actions (CAPA).
Monitor Cp/Cpk and manufacturing yields.
Conduct root cause analysis using 8D, Fishbone, 5 Why, and FMEA.
Ensure compliance with quality standards and customer requirements.
Support reliability testing and qualification activities.
Drive cost reduction, productivity enhancement, and waste elimination projects.
Utilize Lean Manufacturing and Six Sigma methodologies.
Lead or participate in continuous improvement initiatives.
Create and maintain process documentation, work instructions, and specifications.
Prepare engineering reports, qualification reports, and technical presentations.
Ensure compliance with safety, environmental, and company standards.