Process Engineer

Renesas Electronics Corporation; Kuala Lumpur; On-site; MYR 60,000 - 90,000; Full time

Job summary

Renesas Electronics Corporation in Malaysia is seeking a Process Engineer with at least 2 years of hands-on experience in semiconductor back-end assembly, focusing on die bonding and wire bonding.

The role centers on process setup, optimization, yield improvement, and troubleshooting to ensure stable, high-quality manufacturing performance. You will analyze data, drive continuous improvement, and support production operations across cross-functional teams.

Qualifications

• Bachelor’s degree in Engineering (Materials, Mechanical, or related field).
• Minimum 2 years of experience in semiconductor back-end assembly
• Strong knowledge of die bonding and wire bonding processes
• Familiarity with back-end materials such as leadframes, substrates, adhesives, and bonding wires
• Experience with process characterization, DOE, and data analysis is an advantage
• Good problem-solving, communication, and teamwork skills.

Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
• Collaborate with cross‑functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability

Skills

Problem-solving

Teamwork

Communication

Data analysis

Education

Bachelor’s degree in Engineering (Materials, Mechanical, or related field)

Tools

DOE

SPC

CPK

Job description

We are seeking a Process Engineer with a minimum of 2 years of hands‑on experience in semiconductor back‑end assembly processes, particularly die bonding and wire bonding. The successful candidate will be responsible for process setup, optimization, yield improvement, and troubleshooting to ensure stable and high‑quality manufacturing performance.

The role requires strong technical understanding of back‑end equipment, materials, and process interactions, as well as the ability to analyze data, drive continuous improvement, and support production operations.

Key Responsibilities

• Develop, optimize, and sustain die bond and wire bond processes to meet quality, yield, and reliability requirements
• Perform process troubleshooting and root cause analysis for yield loss, defects, and equipment issues
• Support new product introduction (NPI), process qualification, and transfer to mass production
• Establish and maintain process parameters, work instructions, and control plans
• Analyze process data using statistical methods (e.g. SPC, CPK, trend analysis)
• Collaborate with cross‑functional teams including Production, Quality, Equipment, and R&D
• Drive continuous improvement activities for cost, yield, cycle time, and reliability

Qualifications

• Bachelor’s degree in Engineering (Materials, Mechanical, or related field)
• Minimum 2 years of experience in semiconductor back‑end assembly
• Strong knowledge of die bonding and wire bonding processes
• Familiarity with back‑end materials such as leadframes, substrates, adhesives, and bonding wires
• Experience with process characterization, DOE, and data analysis is an advantage
• Good problem‑solving, communication, and teamwork skills.

Additional Advantage

• Experience with QFN, or similar packages is added advantage.
• Knowledge of yield improvement, reliability testing, and failure analysis
• Exposure to automation, equipment setup, and process optimization

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.