Staff Process Engineer: PQFN Packaging & Process Optimization

Aitomic Jobs; Shah Alam; On-site; MYR 90,000 - 150,000; Full time

Job summary

Renesas Electronics in Malaysia is seeking a Staff Process Engineer to qualify, sustain and improve Power QFN and Cu Clip related thin die assembly processes. You will design packages, develop qualification processes for PQFN, and ramp up manufacturing volume while ensuring quality and cost targets.

The role requires knowledge of PQFN/WLCSP packages, wire bonding, SPC and JMP, and strong English communication.

Qualifications

• Experience with PQFN/WLCSP and leaded packages.
• Knowledge of SPC and JMP used for quality analysis.
• Strong communication skills in English.

Responsibilities

• Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
• Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.

Skills

Wire bonding

Strong communication

English proficiency

Process engineering

Education

Bachelor's degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences

Tools

JMP

SPC

Job description

Renesas Electronics in Malaysia is seeking a Staff Process Engineer to qualify, sustain and improve Power QFN and Cu Clip related thin die assembly processes. You will design packages, develop qualification processes for PQFN, and ramp up manufacturing volume while ensuring quality and cost targets.

The role requires knowledge of PQFN/WLCSP packages, wire bonding, SPC and JMP, and strong English communication.