Wirebond Process Engineer: Yield & Automation Leader

Michael Page

Kuala Lumpur

On-site

MYR 60,000 - 90,000

Full time

4 days ago
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Benefits offered by this job

Competitive remuneration

Job summary

Michael Page is representing a multinational semiconductor client in Malaysia. We seek a seasoned Wirebond Process Engineer to support daily manufacturing operations, optimise wirebond processes, and lead root-cause investigations.

You will develop automated programmes, participate in new product transitions, and drive improvements across yield, productivity, and quality. Requirements include a minimum of 5 years in wirebond process engineering, hands-on experience with KNS and ASM equipment,

Qualifications

  • Bachelor's degree in a relevant engineering field.
  • Minimum 5 years of semiconductor wirebond process engineering experience.
  • Hands-on experience with wirebond equipment and processes.

Responsibilities

  • Support daily manufacturing operations and ensure stable wirebond process performance.
  • Develop, qualify, and optimise wirebond processes to improve yield, productivity, quality, and reliability.
  • Create and maintain automated wirebond programmes and optimise wedge bonding process parameters.
  • Perform process characterisation, experimentation, validation, and capability studies.
  • Lead root cause investigations for process-related issues, quality excursions, and yield losses.
  • Establish and maintain SPC methodologies and monitoring strategies.
  • Develop and maintain technical documentation, process specs, and work instructions.
  • Support equipment qualification, process start-ups, transfers, and production ramp activities.
  • Drive continuous improvement projects focused on cost reduction and efficiency.

Skills

Wirebond
SPC
Root cause
Data analysis
Stakeholder mgmt
Manufacturing Eng
Problem solving

Education

Bachelor's Degree in Electrical Engineering
Bachelor's Degree in Mechanical Engineering

Tools

KNS equipment
ASM equipment

Job description

Michael Page is representing a multinational semiconductor client in Malaysia. We seek a seasoned Wirebond Process Engineer to support daily manufacturing operations, optimise wirebond processes, and lead root-cause investigations.

You will develop automated programmes, participate in new product transitions, and drive improvements across yield, productivity, and quality. Requirements include a minimum of 5 years in wirebond process engineering, hands-on experience with KNS and ASM equipment,

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