Assembly Die Bond Process Engineer

NXP Semiconductors; Kuala Lumpur; On-site; MYR 90,000 - 130,000; Full time

Job summary

NXP Semiconductors Malaysia is seeking an Assembly Die Bond Engineer to develop, optimize, and sustain die bonding processes in semiconductor assembly, driving quality, yield, cycle-time reduction, and cost efficiency while supporting NPI and continuous improvement initiatives.

The role focuses on process development, daily production support, and maintaining robust documentation and compliance across projects. A strong engineering background in semiconductor die bonding is required.

Qualifications

• Bachelor/Master in related engineering major with semiconductor experience in Die bond.

Responsibilities

• Develop, qualify, and optimize die bonding processes for semiconductor packages.
• Establish process parameters and operating specifications.
• Perform process characterization and verification activities.
• Support new package development and technology transfers.
• Provide daily engineering support to manufacturing operations.
• Troubleshoot die bond-process related issues.
• Analyze yield losses and process excursions.
• Implement corrective and preventive actions (CAPA).
• Monitor Cp/Cpk and manufacturing yields.
• Conduct root cause analysis using 8D, Fishbone, 5 Why, and FMEA.
• Ensure compliance with quality standards and customer requirements.
• Support reliability testing and qualification activities.
• Drive cost reduction, productivity enhancement, and waste elimination projects.
• Utilize Lean Manufacturing and Six Sigma methodologies.
• Lead or participate in continuous improvement initiatives.
• Create and maintain process documentation, work instructions, and specifications.
• Prepare engineering reports, qualification reports, and technical presentations.
• Ensure compliance with safety, environmental, and company standards.

Skills

Process development

Optimization

CAPA

Root cause analysis

Lean Six Sigma

Yield analysis

Die bonding knowledge

Education

Bachelor's degree in engineering

Master's degree in engineering

Tools

8D problem solving

FMEA

Fishbone diagram

5 Whys

Job description

Assembly Die Bond Engineer is responsible for developing, optimizing, and sustaining die bonding processes within semiconductor assembly manufacturing. The role focuses on achieving high product quality, yield improvement, process stability, cycle time reduction, and cost efficiency while supporting new product introductions (NPI) and continuous improvement initiatives.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize die bonding processes for semiconductor packages.
• Establish process parameters and operating specifications.
• Perform process characterization and verification activities.
• Support new package development and technology transfers.

Production Support

• Provide daily engineering support to manufacturing operations.
• Troubleshoot die bond-process related issues.
• Analyze yield losses and process excursions.
• Implement corrective and preventive actions (CAPA).

Quality & Reliability

• Monitor process capability (Cp/Cpk) and manufacturing yields.
• Conduct root cause analysis using tools such as 8D, Fishbone, 5 Why, and FMEA.
• Ensure compliance with quality standards and customer requirements.
• Support reliability testing and qualification activities.

Continuous Improvement

• Drive cost reduction, productivity enhancement, and waste elimination projects.
• Utilize Lean Manufacturing and Six Sigma methodologies.
• Lead or participate in continuous improvement initiatives.

Documentation & Compliance

• Create and maintain process documentation, work instructions, and specifications.
• Prepare engineering reports, qualification reports, and technical presentations.
• Ensure compliance with safety, environmental, and company standards.

Qualification: Bachelor/Master in related engineering major with semiconductor experience in Die bond.

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