Principal Technology Development Engineer – Thermal-Compression Bonding (TCB)

FusionAP Sdn Bhd; Penang; On-site; MYR 180,000 - 320,000; Full time

Job summary

FusionAP Sdn Bhd is seeking a Principal Technology Development Engineer specializing in Thermal-Compression Bonding to drive next-generation packaging solutions. You will develop TCB recipes, optimize thermal profiles, and lead cross-functional DOE studies to achieve high-yield, cost-effective semiconductor manufacturing.

The role also focuses on process integration, yield improvement, and technology transfer from R&D to high-volume production.

Qualifications

• Bachelor's degree in a technical field as listed.
• 10+ years of semiconductor process engineering experience with a focus on die-bonding/TCB is preferred.
• Deep expertise in Thermal-Compression Bonding or related die-bonding technologies.
• Hands-on experience with DOE, SPC, FMEA, and data analysis.
• Strong communication and collaboration skills to lead cross-functional teams.

Responsibilities

• Develop, optimize, and maintain TCB recipes for advanced packaging applications.
• Fine-tune TCB thermal profiles to ensure high yield and prevent defects.
• Design multi-factor DoE studies to establish process windows and performance baselines.
• Assess impact of material/equipment changes on TCB performance and reliability.
• Lead process transfer from R&D to high-volume manufacturing and support tool installations.

Skills

DOE planning

SPC

FMEA

Analytical thinking

Problem solving

Education

Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics

Tools

Python

SQL

Job description

Principal Technology Development Engineer – Thermal-Compression Bonding (TCB)

About FusionAP

FusionAP is a Malaysia-based startup advanced packaging company focused on delivering innovative 2.5D, 3D, and next-generation packaging solutions. Through engineering excellence and strategic partnerships, FusionAP enables cutting-edge technologies for AI, high-performance computing (HPC) to co-packaged optic , and other advanced semiconductor applications. We are building a world-class engineering team to develop and industrialize advanced packaging technologies that power the future of computing and are looking for like minded vibrant individuals to be part of the journey.

The rapid expansion of artificial intelligence, high performance computing (HPC), and cloud-focused networking has positioned advanced packaging as a critical differentiator in semiconductor manufacturing. We are seeking a highly motivated and experienced Principal Technology Development Engineer specializing in Thermal-Compression Bonding (TCB) to drive next-generation packaging solutions

In this role, you will operate at the intersection of wafer fab processing, material science, and mechanical assembly 3. You will focus on TCB recipe creation, process optimization, and deep cross-process integration to support high-yield, cost-effective semiconductor manufacturing for advanced architectures.

Key Responsibilities

• Process Development & Innovation: Develop, optimize, and maintain TCB recipes for advanced packaging applications, including die stacking, chip-to-wafer, and chip-to-substrate integrations for solders to Cu, solders to solders or Cu-Cu hybrid bonding
• Precision Bonding Parameters: Optimize critical TCB thermal profiles, such as rapid heating and cooling rates, dynamic force triggers, includes carefully controlling solder wetting to prevent bridging and avoiding "white bump" micro-cracking in fragile extreme low-k (ELK) dielectric layers.
• Experimental Rigor: Design and execute multi-factor Design of Experiments (DOE) to establish robust process windows and performance baselines.
• Process Integration & Interaction: Analyse the impact of material changes, equipment variations, and upstream wafer and Flip Chip processes on overall TCB performance. You will utilize polymer re-passivation layers as internal stress buffers to alleviate local strain on fragile die structures during rapid thermal cycles.
• Yield Improvement & Quality Control: Lead continuous yield improvement, defect reduction, and cost optimization initiatives 8. You will implement Statistical Process Control (SPC) and apply methodologies like FMEA, Control Plans, 8D, and root cause analysis to resolve process excursions and also establish effective early signal detection from various learning
• Equipment & Material Engineering: Evaluate, qualify, and optimize TCB equipment, tooling, and materials while working closely with suppliers to manage specifications, quality, and risk.
• Technology Transfer: Own the process transfer from the research and development phase to high-volume manufacturing (HVM), establishing the official Process of Record (POR) and supporting new tool installations and production ramps.

Minimum Qualifications

• Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related technical field.
• 10+ years of experience in semiconductor process engineering, with a strong preference for backgrounds in Flip Chip or Advanced Packaging.
• Deep expertise in TCB or related die-bonding technologies, with a solid understanding of assembly processes and upstream/downstream interactions.
• Hands-on experience with DOE, SPC, FMEA, and advanced data analysis techniques.
• Strong analytical, problem-solving, and data interpretation skills, with the ability to work independently and lead projects.
• Excellent communication and teamwork abilities to collaborate effectively across multidisciplinary teams.

Preferred Qualifications

• Master's degree or Ph.D. in a related engineering or scientific discipline.
• Experience in advanced packaging technologies, including 2.5D/3D integration, multi-die chiplets, and wafer bonding.
• Deep knowledge of material science related to bonding interfaces, including solders, Cu-Cu bonding, underfill, and intermetallic compound formation.
• Familiarity with equipment automation, data analytics, and programming languages such as Python or SQL for tracking critical-to-quality metrics
• Proven experience in project management and cross-site technology transfer

Additional Information

• Travel: minimum, except for training at suppliers or technical conferences
• Language: Fluent English (written and verbal); additional language proficiency a plus for global collaboration