Lead Thermal-Compression Bonding Engineer – 2.5D/3D Packaging

FusionAP Sdn Bhd; Penang; On-site; MYR 180,000 - 320,000; Full time

Job summary

FusionAP Sdn Bhd is seeking a Principal Technology Development Engineer specializing in Thermal-Compression Bonding to drive next-generation packaging solutions. You will develop TCB recipes, optimize thermal profiles, and lead cross-functional DOE studies to achieve high-yield, cost-effective semiconductor manufacturing.

The role also focuses on process integration, yield improvement, and technology transfer from R&D to high-volume production.

Qualifications

• Bachelor's degree in a technical field as listed.
• 10+ years of semiconductor process engineering experience with a focus on die-bonding/TCB is preferred.
• Deep expertise in Thermal-Compression Bonding or related die-bonding technologies.
• Hands-on experience with DOE, SPC, FMEA, and data analysis.
• Strong communication and collaboration skills to lead cross-functional teams.

Responsibilities

• Develop, optimize, and maintain TCB recipes for advanced packaging applications.
• Fine-tune TCB thermal profiles to ensure high yield and prevent defects.
• Design multi-factor DoE studies to establish process windows and performance baselines.
• Assess impact of material/equipment changes on TCB performance and reliability.
• Lead process transfer from R&D to high-volume manufacturing and support tool installations.

Skills

DOE planning

SPC

FMEA

Analytical thinking

Problem solving

Education

Bachelor's degree in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics

Tools

Python

SQL

Job description

FusionAP Sdn Bhd is seeking a Principal Technology Development Engineer specializing in Thermal-Compression Bonding to drive next-generation packaging solutions. You will develop TCB recipes, optimize thermal profiles, and lead cross-functional DOE studies to achieve high-yield, cost-effective semiconductor manufacturing.

The role also focuses on process integration, yield improvement, and technology transfer from R&D to high-volume production.