Packaging Module Development Engineer

Intel Corporation; Malaysia; Hybrid; MYR 180,000 - 300,000; Full time

Job summary

Intel Kulim in Malaysia seeks a Process Development Engineer to advance solder ball attach, chip attach and related packaging processes. You will work on new products and test vehicles, applying DOE, SPC and FMEA to drive yield, cost and reliability improvements.

You will collaborate with cross-functional teams to develop materials, transfer processes to high-volume manufacturing, and document improvements with technical papers.

Qualifications

• Bachelor's or higher in mechanical, materials, chemical, electrical, physics or mechatronics.
• 5 years in electronic packaging and/or development experience.
• Experience with chip attach, deflux or ball attach processes.
• R&D background preferred.
• Strong data analysis and problem-solving skills.
• Excellent communication skills.
• Able to work under tight timelines and pressure.

Skills

Data analysis

Problem solving

Communication skills

Cross-functional collaboration

Proactive attitude

Time management

Education

BEng/MEng/MSc/PhD in engineering

Job description

Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process.

Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle. Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization. Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories. Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations. Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.

Qualifications

• BEng/MEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics)
• Research and Development background from MSc/PhD is preferred.
• 5 years working experience in electronic packaging AND/OR development experience is preferred.
• Research and Development background and experience in Chip Attach, Deflux or Ball Attach Process.
• Excellent influencing, written and verbal communication skills.
• Strong data analysis capabilities and problem solving skills.
• Proactive and positive approach towards challenges.
• Able to work under tight timelines and schedules, and perform under pressure.

Job Type

Position of Trust: N/A Experienced Hire Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Work Model for this Role

This role will require an on-site presence.

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.