Precision Wafer Laser & Saw Process Engineer

Intel Corporation; Kulim; Presencial; MYR 60.000 - 100.000; Jornada completa

Descripción de la vacante

Intel Corporation in Kulim, Malaysia is seeking a Process and Equipment Engineer specializing in Wafer Laser and Saw Singulation Technologies. You will own and optimize laser ablation and wafer saw processes to enhance yield, quality and throughput in a high-volume semiconductor environment.

You will lead equipment troubleshooting, preventive maintenance, and cross-functional collaboration with TD teams to qualify next-generation laser processing technologies and support NPI.

Formación

• Bachelor’s or Master’s Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Materials Engineering, Physics, or a related engineering discipline.
• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing are encouraged to apply.
• 0-1 year experience in relevant industry.

Responsabilidades

• Process Optimization: own and optimize laser ablation and wafer saw parameters for best yield and throughput.
• Yield Improvement: drive defect reduction targeting burrs, chipping, kerf quality, recast.
• Equipment Engineering: lead troubleshooting and reliability improvements for laser ablation and wafer saw equipment.
• Maintenance Strategy: develop preventive and corrective maintenance plans to maximize uptime.
• Data Analytics: use SPC, DOE, FMEA, JMP and analytics to identify root causes of variation and failures.
• Automation and AI Solutions: develop Python/AI-based solutions for defect monitoring and predictive maintenance.
• NPI: support process qualification, tech transfer, and ramp for new products.

Conocimientos

Wafer laser

Laser ablation

Wafer singulation

Data analytics

Python

Educación

Bachelor’s or Master’s Degree in Electrical/Electronics/Mechanical/Mechatronics/Materials/Physics or related engineering discipline

Herramientas

JMP

SQL

Power BI

Python

Descripción del empleo

Intel Corporation in Kulim, Malaysia is seeking a Process and Equipment Engineer specializing in Wafer Laser and Saw Singulation Technologies. You will own and optimize laser ablation and wafer saw processes to enhance yield, quality and throughput in a high-volume semiconductor environment.

You will lead equipment troubleshooting, preventive maintenance, and cross-functional collaboration with TD teams to qualify next-generation laser processing technologies and support NPI.