Process Development Engineer - Ball Attach & Package Saw

STMicroelectronics; Muar; On-site; MYR 67,000 - 112,000; Full time

Job summary

STMicroelectronics in Malaysia is seeking a highly capable Process Engineer to develop, set up, and industrialize PLP Ball Attach and Package Saw processes within our semiconductor assembly operations. The role requires deep expertise in process development and hands-on manufacturing support.

The successful candidate will characterize processes, prepare specifications, SOPs, FMEAs, and control plans, while driving improvements in quality, yield, and reliability across new products and materials.

Qualifications

• Bachelor’s, Master’s, or PhD in Engineering or related field.
• 3+ years of relevant experience in process development, semiconductor manufacturing, or assembly processes.
• Strong statistical data analysis skills.
• Experience with 8D, DMAIC, Process Mapping, Fishbone analysis, and 5 Whys.
• Ability to identify issues quickly, respond to process challenges, and implement effective solutions.
• Strong understanding of production environments and manufacturing operations.
• Demonstrated teamwork, ownership, and commitment to high-quality project execution.
• Ability to work effectively in a fast-paced and collaborative environment.

Responsibilities

• Develop, set up, and industrialize PLP Ball Attach and Package Saw processes.
• Support the introduction of new products, materials, and technologies into assembly manufacturing.
• Characterize PLP Ball Attach and Package Saw processes and related materials.
• Prepare, review, and update process specifications, SOPs, FMEAs, process control plans, and related documentation.
• Conduct process optimization to improve quality, yield, productivity, and reliability.
• Provide technical support for process-related issues, including quality concerns and troubleshooting.
• Collaborate with cross-functional teams, including Engineering, Production, Quality, and Operations, to ensure smooth project execution.
• Drive continuous improvement activities and support manufacturing readiness for new applications.

Skills

Statistical analysis

8D

DMAIC

Process mapping

Fishbone analysis

5 Whys

Problem solving

Teamwork

Education

Engineering degree (Bachelor/Master/PhD)

Job description

STMicroelectronics in Malaysia is seeking a highly capable Process Engineer to develop, set up, and industrialize PLP Ball Attach and Package Saw processes within our semiconductor assembly operations. The role requires deep expertise in process development and hands-on manufacturing support.

The successful candidate will characterize processes, prepare specifications, SOPs, FMEAs, and control plans, while driving improvements in quality, yield, and reliability across new products and materials.