Process Engineer: Plasma Etch, Solder Ball Attach, Saw

Strategic Micro Systems of NJ, LLC.; Muar; On-site; MYR 120,000 - 150,000; Full time

Job summary

STMicroelectronics Malaysia seeks a Senior Process Engineer to own and optimize plasma etching, solder ball attach, and package saw processes. You will drive stability, high yield, and quality while minimizing customer complaints.

You will lead process characterization, risk assessments, and change control, coordinating with production, equipment, quality, maintenance, and customer quality teams to achieve manufacturing excellence. Emphasis on data-driven decisions and continuous improvement.

Qualifications

• Bachelor’s degree or higher in Engineering or related field.
• Minimum 2 years of process engineering experience in semiconductor assembly/manufacturing.
• Strong knowledge of process control, troubleshooting, yield improvement, and defect reduction.

Responsibilities

• Own and improve manufacturing process performance for Plasma Etching, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
• Drive day-to-day process control, troubleshooting, and continuous improvement for the assigned processes to reduce production downtime, scrap, and line disruption.
• Act as the key process owner for resolving process-related issues, including yield loss, quality escapes, customer incidents, and internal/external complaints.
• Lead process characterization, optimization, and qualification activities for Plasma Etching, Solder Ball Attach, and Package Saw.
• PerformFMEA, risk assessment, and change management for process or material changes to ensure smooth implementation and robust control.
• Develop, maintain, and improve process recipes, parameters, SOPs, and control plans in alignment with production and quality requirements.
• Collaborate closely with Production, Equipment, Quality, Maintenance, and Customer Quality teams to support operational excellence and business targets.
• Use statistical tools and process control methods such as SPC, Cp/Cpk, GR&R, and other quality tools to monitor stability and drive improvement.
• Support and lead root cause analysis, excursion management, defect reduction, and corrective/preventive actions.
• Initiate and support yield improvement, cost reduction, capacity improvement, and other manufacturing excellence projects.

Skills

Process engineering

Semiconductor manufacturing

Root cause analysis

FMEA

SPC

Change management

Data analysis

Cross-functional collaboration

Education

Bachelor’s degree or higher in Engineering

Tools

Cp/Cpk

GR&R

SPC

Job description

STMicroelectronics Malaysia seeks a Senior Process Engineer to own and optimize plasma etching, solder ball attach, and package saw processes. You will drive stability, high yield, and quality while minimizing customer complaints.

You will lead process characterization, risk assessments, and change control, coordinating with production, equipment, quality, maintenance, and customer quality teams to achieve manufacturing excellence. Emphasis on data-driven decisions and continuous improvement.