Wafer Laser & Saw Process Engineer

Intel Corporation

Kulim

On-site

MYR 180,000 - 260,000

Full time

5 days ago

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Job summary

Intel Corporation in Kulim, Malaysia seeks a Process and Equipment Engineer specializing in wafer laser and saw singulation technologies. You will own process optimization, drive yield improvements, and lead equipment reliability efforts in a high-volume manufacturing environment.

As part of the Wafer Packaging Manufacturing team, you will deploy automation, AI-driven monitoring, and data analytics to reduce defects and improve MA, cost, and throughput while supporting NPI and transfer.

Qualifications

Bachelor’s or Master’s Degree in Electrical, Electronics, Mechanical, Mechatronics, Materials, Physics, or related field.
Fresh graduates encouraged; 0–1 year experience.
Preferred: >2 years in semiconductor or wafer singulation processes.

Responsibilities

Own and optimize laser ablation and wafer saw parameters to maximize yield and throughput.
Drive defect reduction for burrs, chipping, kerf quality, and recast.
Lead troubleshooting and reliability improvements for laser and saw equipment.
Develop maintenance plans to maximize uptime and MA.
Apply SPC/DOE/FMEA analytics to root-cause process variation.
Collaborate with TD teams to evaluate next‑gen laser and singulation tech.
Support NPI process qualification and high-volume ramp.