Process Engineer: Plasma Etch, Solder Ball Attach, Package Saw

STMicroelectronics; Muar; On-site; MYR 70,000 - 110,000; Full time

Job summary

STMicroelectronics in Malaysia seeks a Process Engineer to own and improve plasma etching, solder ball attach and package saw processes. You will drive day-to-day control, troubleshoot issues, and lead process improvements to achieve high yield and quality with minimal customer impact.

Join a global manufacturing environment, collaborate with Production, Quality, and Maintenance teams, and apply SPC and other quality tools to monitor stability and implement corrective actions.

Qualifications

• PhD/Master/Bachelor’s degree or higher in Engineering or related field such as Mechanical, Electrical, Material Science, Mechatronics, or Manufacturing Engineering.
• Minimum 2 years of process engineering experience in semiconductor assembly/manufacturing.
• Strong knowledge of process control, troubleshooting, yield improvement, and defect reduction in semiconductor manufacturing.
• Proven experience in root cause analysis, problem solving, FMEA, SPC, and change management.
• Ability to analyze process data, identify trends, and implement effective corrective actions.

Responsibilities

• Own and improve manufacturing process performance for Plasma Etching, Solder Ball Attach, and Package Saw to achieve stable output, high yield, strong quality, and minimal customer complaints.
• Drive day-to-day process control, troubleshooting, and continuous improvement for the assigned processes to reduce production downtime, scrap, and line disruption.
• Act as the key process owner for resolving process-related issues, including yield loss, quality escapes, customer incidents, and internal/external complaints.
• Lead process characterization, optimization, and qualification activities for Plasma Etching, Solder Ball Attach, and Package Saw.
• PerformFMEA, risk assessment, and change management for process or material changes to ensure smooth implementation and robust control.
• Develop, maintain, and improve process recipes, parameters, SOPs, and control plans in alignment with production and quality requirements.
• Collaborate closely with Production, Equipment, Quality, Maintenance, and Customer Quality teams to support operational excellence and business targets.
• Use statistical tools and process control methods such as SPC, Cp/Cpk, GR&R, and other quality tools to monitor stability and drive improvement.
• Support and lead root cause analysis, excursion management, defect reduction, and corrective/preventive actions.
• Initiate and support yield improvement, cost reduction, capacity improvement, and other manufacturing excellence projects.

Skills

Process engineering

Semiconductor manufacturing

Statistical methods

Root cause analysis

Education

Bachelor's degree in Engineering

Job description

STMicroelectronics in Malaysia seeks a Process Engineer to own and improve plasma etching, solder ball attach and package saw processes. You will drive day-to-day control, troubleshoot issues, and lead process improvements to achieve high yield and quality with minimal customer impact.

Join a global manufacturing environment, collaborate with Production, Quality, and Maintenance teams, and apply SPC and other quality tools to monitor stability and implement corrective actions.