Process and Equipment Engineer

Intel Corporation; Kulim; On-site; MYR 60,000 - 100,000; Full time

Job summary

Intel Corporation in Kulim, Malaysia is seeking a Process and Equipment Engineer specializing in Wafer Laser and Saw Singulation Technologies. You will own and optimize laser ablation and wafer saw processes to enhance yield, quality and throughput in a high-volume semiconductor environment.

You will lead equipment troubleshooting, preventive maintenance, and cross-functional collaboration with TD teams to qualify next-generation laser processing technologies and support NPI.

Qualifications

• Bachelor’s or Master’s Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Materials Engineering, Physics, or a related engineering discipline.
• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing are encouraged to apply.
• 0-1 year experience in relevant industry.

Responsibilities

• Process Optimization: own and optimize laser ablation and wafer saw parameters for best yield and throughput.
• Yield Improvement: drive defect reduction targeting burrs, chipping, kerf quality, recast.
• Equipment Engineering: lead troubleshooting and reliability improvements for laser ablation and wafer saw equipment.
• Maintenance Strategy: develop preventive and corrective maintenance plans to maximize uptime.
• Data Analytics: use SPC, DOE, FMEA, JMP and analytics to identify root causes of variation and failures.
• Automation and AI Solutions: develop Python/AI-based solutions for defect monitoring and predictive maintenance.
• NPI: support process qualification, tech transfer, and ramp for new products.

Skills

Wafer laser

Laser ablation

Wafer singulation

Data analytics

Python

Education

Bachelor’s or Master’s Degree in Electrical/Electronics/Mechanical/Mechatronics/Materials/Physics or related engineering discipline

Tools

JMP

SQL

Power BI

Python

Job description

Job Description:

The Role and Impact
As a Process and Equipment Engineer specializing in Wafer Laser and Saw Singulation Technologies, you will serve as the technical owner responsible for driving the performance, capability, and stability of advanced wafer singulation processes within our high-volume semiconductor manufacturing environment. In this role, you will leverage your expertise in precision laser-material interaction, wafer dicing, laser ablation, and singulation technologies to solve complex process and equipment challenges, optimize manufacturing performance, and implement innovative solutions that enable next-generation semiconductor products.

Your hands-on contributions will directly impact factory yield, quality, equipment uptime, Manufacturing Availability (MA), cost competitiveness, and process robustness. You will play a critical role in supporting Intel’s advanced packaging, NPI and wafer manufacturing roadmap through the deployment of cutting-edge laser and sawing technologies.

Business group:
As part of Intel Wafer Packaging Manufacturing (WPM), you will join a globally recognized organization at the forefront of semiconductor manufacturing and advanced packaging technologies. Our organization develops and deploys innovative wafer processing, laser manufacturing, and singulation solutions that enable Intel’s next-generation computing platforms.
The Wafer Laser Ablation and Saw Engineering team plays a critical role in delivering high-yield, high-quality wafer singulation processes through the integration of advanced laser processing, precision sawing, automation, data analytics, and AI-driven manufacturing solutions. We continuously push the boundaries of wafer processing capability to meet increasingly demanding product requirements across advanced packaging and silicon technologies.
Working within a highly collaborative environment, you will partner with global factory networks, technology development teams, virtual factories, equipment suppliers, and manufacturing stakeholders to develop breakthrough solutions that improve yield, quality, cost, and manufacturing scalability. This role offers unique opportunities to influence future technology roadmaps while supporting Intel’s mission to create world-changing technology that improves the life of every person on the planet.

Key Responsibilities:

• Process Optimization - Own and optimize laser ablation and wafer saw process parameters to achieve best-in-class yield, quality, and throughput.
• Yield Improvement - Drive systematic defect reduction initiatives targeting burrs, chipping, cracking, kerf quality, and recast.
• Equipment Engineering - Lead complex troubleshooting and reliability improvements for laser ablation, laser dicing, and wafer saw equipment.
• Maintenance Strategy - Develop and execute preventive and corrective maintenance plans to maximize equipment uptime and MA.
• Data Analytics - Utilize SPC, DOE, FMEA,JMP and advanced analytics to identify root causes of process variation and equipment failures.
• Automation and AI Solutions - Develop and deploy Python/Co-pilot/Github/ Gemini- and AI-based solutions for defect monitoring, predictive maintenance, and process optimization.
• Technology Development - Collaborate with TD teams to evaluate, develop, and qualify next-generation laser processing and singulation technologies.
• New Product Introduction (NPI) - Support process qualification, technology transfer, and high-volume manufacturing ramp for new products.
• Cross-Functional Collaboration - Partner with upstream and downstream process owners to improve end-to-end manufacturing performance.
• Supplier Engagement - Work closely with equipment vendors to implement hardware upgrades, software enhancements, and productivity improvements.
• Documentation and Standards - Develop and standardize SOPs, troubleshooting guides, BKMs, and engineering documentation.
• Technical Leadership - Present technical findings, project updates, and business impact assessments to factory stakeholders and leadership teams.
• Manufacturing Excellence - Drive continuous improvement initiatives focused on yield, quality, cost reduction, and cycle-time optimization.
• Safety and Compliance - Ensure compliance with Intel safety, quality, and environmental requirements while promoting a strong safety culture.

Qualifications:

Minimum Qualifications:

• Bachelor’s or Master’s Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Materials Engineering, Physics, or a related engineering discipline.
• Fresh graduates with strong technical aptitude, problem-solving skills, and a passion for semiconductor manufacturing are encouraged to apply.
• 0-1 year experience in relevant industry.

Preferred Qualification:

• More than 2 years in relevant industry.
• Experience in semiconductor manufacturing, particularly in wafer singulation, laser ablation, laser dicing, stealth dicing, wafer saw, Die Preparation, or advanced packaging processes, will be an added advantage.
• Strong understanding of laser-material interaction, optics, motion control systems, vision alignment systems, and precision manufacturing technologies is highly desirable.
• Knowledge of Statistical Process Control (SPC), statistical data analysis, and structured problem-solving methodologies; experience with Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and Root Cause Analysis (RCA) will be an added advantage.
• Experience with data analytics, automation, and programming tools such as Python, JMP, SQL, Power BI, or AI-based manufacturing applications will be an added advantage.
• Demonstrated ability to troubleshoot technical challenges using a structured and data-driven approach.
• Strong analytical and problem-solving skills with the ability to work independently and in a team-based environment.
• Excellent communication and interpersonal skills with the ability to collaborate effectively across cross-functional teams.
• Self-motivated, results-oriented, and passionate about continuous improvement, innovation, and cost reduction.
• Willingness to work in a cleanroom manufacturing environment and support factory operations as required.

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION:

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.