Packaging Process Engineer – Ball/Chip Attach R&D

Intel; Kulim; On-site; MYR 120,000 - 180,000; Full time

Job summary

Intel in Malaysia, Kulim, is seeking a Process Development Engineer for Solder Ball Attach or Chip Attach in the Technology Development Organization. You will focus on process and technology development for electronic packaging assembly on new products and test vehicles, collaborating with cross-functional teams.

The role requires hands-on R&D experience in DOE, SPC, FMEA, and data analysis to qualify new materials and transfer to high-volume manufacturing.

Qualifications

• 5 years experience in electronic packaging or development.
• Background in Chip Attach, Deflux or Ball Attach.
• Strong data analysis and problem solving.
• Excellent communication skills.
• Able to work under tight timelines and pressure.

Responsibilities

• Develops process specs and DOE to optimize packaging assembly.
• Transfer technologies to high-volume manufacturing.
• Collaborate cross-functionally on test vehicles and products.
• Conduct fundamental studies and experiments to characterize materials.
• Document improvements with white papers.

Skills

Process Development

Process Engineering

DOE

SPC

FMEA

Quality Assurance

Yield Improvement

Data Analysis

Problem Solving

Communication

Education

BEng/MEng/MSc/PhD in Engineering

Job description

Intel in Malaysia, Kulim, is seeking a Process Development Engineer for Solder Ball Attach or Chip Attach in the Technology Development Organization. You will focus on process and technology development for electronic packaging assembly on new products and test vehicles, collaborating with cross-functional teams.

The role requires hands-on R&D experience in DOE, SPC, FMEA, and data analysis to qualify new materials and transfer to high-volume manufacturing.