Packaging Process Development Engineer – Die/Chip/Ball Attach

Intel Corporation; Malaysia; Hybrid; MYR 180,000 - 300,000; Full time

Job summary

Intel Kulim in Malaysia seeks a Process Development Engineer to advance solder ball attach, chip attach and related packaging processes. You will work on new products and test vehicles, applying DOE, SPC and FMEA to drive yield, cost and reliability improvements.

You will collaborate with cross-functional teams to develop materials, transfer processes to high-volume manufacturing, and document improvements with technical papers.

Qualifications

• Bachelor's or higher in mechanical, materials, chemical, electrical, physics or mechatronics.
• 5 years in electronic packaging and/or development experience.
• Experience with chip attach, deflux or ball attach processes.
• R&D background preferred.
• Strong data analysis and problem-solving skills.
• Excellent communication skills.
• Able to work under tight timelines and pressure.

Skills

Data analysis

Problem solving

Communication skills

Cross-functional collaboration

Proactive attitude

Time management

Education

BEng/MEng/MSc/PhD in engineering

Job description

Intel Kulim in Malaysia seeks a Process Development Engineer to advance solder ball attach, chip attach and related packaging processes. You will work on new products and test vehicles, applying DOE, SPC and FMEA to drive yield, cost and reliability improvements.

You will collaborate with cross-functional teams to develop materials, transfer processes to high-volume manufacturing, and document improvements with technical papers.