Packaging Internship: Module Engineering & Manufacturing

Intel Corporation; Malaysia; Hybrid; MYR 13,000 - 27,000; Full time

Job summary

Intel Corporation in Kulim, Malaysia seeks an undergraduate Module Engineering Intern to gain hands-on experience in supporting manufacturing operations and improving equipment performance. You will collaborate with engineers to drive process control improvements and contribute to DOE and data analysis projects during a 3–6 month on-site internship.

The role emphasizes teamwork, strong English communication, and a readiness to learn in a fast-paced manufacturing setting.

Qualifications

• Undergraduate student required to undergo compulsory internship placement.
• Pursuing a Bachelor's Degree in Electrical & Electronic Engineering or related engineering disciplines.
• Good interpersonal, written, and verbal communication skills in English.
• Strong analytical and problem-solving skills.
• Able to work independently and in a team environment.
• Basic knowledge of semiconductor manufacturing, process engineering, or equipment engineering.
• Proficient in Microsoft Office (Excel, PowerPoint, Word); familiarity with programming, SQL, data analytics tools, or engineering software is an added advantage.
• Eager to learn and adapt in a fast-paced manufacturing environment.
• Able to commit to a minimum internship period of 3 to 6 months.

Responsibilities

• Support equipment troubleshooting, maintenance, qualification, and improvement activities.
• Assist in process optimization and continuous improvement projects.
• Collect, analyse, and interpret manufacturing data to support engineering decisions.
• Conduct technical research, literature reviews, and assessments.
• Support Design of Experiments (DOE), data analysis, and validation activities.
• Assist in laboratory experiments and process evaluations.
• Prepare technical reports, presentations, and documentation.
• Collaborate with cross-functional teams to achieve manufacturing and engineering objectives.

Skills

Interpersonal skills

Analytical thinking

Teamwork

Communication skills (English)

Education

Bachelor's degree in Electrical & Electronic Engineering

Tools

Microsoft Office

SQL

Data analytics tools

Engineering software

Job description

Intel Corporation in Kulim, Malaysia seeks an undergraduate Module Engineering Intern to gain hands-on experience in supporting manufacturing operations and improving equipment performance. You will collaborate with engineers to drive process control improvements and contribute to DOE and data analysis projects during a 3–6 month on-site internship.

The role emphasizes teamwork, strong English communication, and a readiness to learn in a fast-paced manufacturing setting.