Assembly Media & Collateral Innovation Engineer

Intel; Kulim; On-site; MYR 80,000 - 120,000; Full time

Job summary

Intel in Kulim, Malaysia seeks a seasoned engineer to develop media and collaterals for advanced assembly packaging, applying DOE/ SPC to optimize quality, cost and reliability. You will create, test and document improvements under simulated field conditions and collaborate with cross-functional teams to drive technology maturation.

You will lead design initiatives, advise on materials, and contribute to process optimization with proficiency in AutoCAD/SolidWorks and strong drawing/tolerancing

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, or Physics.
• 2+ years of experience applying SPC/DOE to develop novel solutions.
• Experience with AutoCAD, SolidWorks, and other packaging tools.
• Experience with engineering drawing, tolerancing, and design rules.

Responsibilities

• Develop media and collaterals for assembly processes and equipment to enable Intel's roadmap.
• Improve efficiency of manufacturing media and collaterals meeting quality, cost, yield and manufacturability targets.
• Document improvements using DOEs and data analysis; write white papers.
• Develop and maintain equipment to evaluate media under simulated field conditions (heat, humidity, vibration).
• Create techniques and tools to detect early quality/reliability issues in media and collaterals.
• Lead design decisions to meet module needs based on failure mechanism understanding.
• Foster innovation and use experimental design to continuously improve media and collateral quality.
• Consult on design problems in assembly packaging; respond to customer requests.
• Standardize qualification, prototypes and methods; coordinate with packaging tech development teams.

Skills

SPC & DOE principles

engineering drawing

tolerancing analysis

design rules

Education

Bachelor's or Master's in Mechanical Engineering or related field

Bachelor's or Master's in Material Engineering

Bachelor's or Master's in Electrical Engineering

Bachelor's or Master's in Physics

Tools

AutoCAD

SolidWorks

Job description

Intel in Kulim, Malaysia seeks a seasoned engineer to develop media and collaterals for advanced assembly packaging, applying DOE/ SPC to optimize quality, cost and reliability. You will create, test and document improvements under simulated field conditions and collaborate with cross-functional teams to drive technology maturation.

You will lead design initiatives, advise on materials, and contribute to process optimization with proficiency in AutoCAD/SolidWorks and strong drawing/tolerancing