CUF Packaging Engineer - Onsite, Thermal & Reliability

Intel; Kulim; On-site; MYR 120,000 - 180,000; Full time

Job summary

Intel Malaysia in Kulim is seeking an Experienced Hire to develop assembly processes and equipment for CUF (capillary underfill) modules, advancing Intel's future packaging platform technologies. The role focuses on optimizing manufacturing efficiency, reliability, and cost, and involves DOE-driven design and documentation through white papers.

The position requires on-site presence, with responsibilities spanning process and equipment development, supplier coordination, and cross-functional

Qualifications

• MSc/PhD in Engineering with focus on thermal/fluid/packaging assembly process engineering or related background, with at least 3 years of working experience.
• Fundamental understanding of semiconductor assembly equipment and processes.
• Developing new processes through hardware /toolset development is a plus.

Responsibilities

• Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Develops and maintains equipment to evaluate silicon and package technologies under simulated field use conditions, such as heat, humidity, temperature cycle, and dynamic forces.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
• Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Skills

Semiconductor Equipment

Thermal/Packaging

DOE & Data Analysis

Education

MSc/PhD in Engineering

Job description

Intel Malaysia in Kulim is seeking an Experienced Hire to develop assembly processes and equipment for CUF (capillary underfill) modules, advancing Intel's future packaging platform technologies. The role focuses on optimizing manufacturing efficiency, reliability, and cost, and involves DOE-driven design and documentation through white papers.

The position requires on-site presence, with responsibilities spanning process and equipment development, supplier coordination, and cross-functional