Packaging Engineering Intern – Hands-on (3–6 months)

Intel Corporation; Kulim; On-site; MYR 17,000 - 23,000; Part time

Job summary

Intel Corporation in Malaysia, Kulim is seeking a Module Engineering Undergraduate Intern to gain hands-on experience supporting manufacturing operations. You will work with engineers to improve equipment performance, process control, and production efficiency, while contributing to projects that drive improvements in manufacturing methodologies.

The role offers exposure to DOE, data analysis, and technical reporting, with collaboration across cross-functional teams.

Qualifications

• This internship is designed for undergraduates completing compulsory industrial training.
• Currently pursuing a Bachelor's Degree in Electrical & Electronic Engineering or related fields.
• Good interpersonal, written, and verbal communication skills in English.
• Strong analytical and problem-solving abilities.
• Able to work independently and in a team environment.
• Basic knowledge of semiconductor manufacturing, process engineering, or equipment engineering.
• Proficient with MS Office (Excel, PowerPoint, Word); familiarity with SQL, data analytics tools, or engineering software is a plus.
• Eager to learn and adapt in a fast-paced manufacturing environment.
• Commit to a minimum internship period of 3 to 6 months, per university requirements.

Responsibilities

• Support equipment troubleshooting, maintenance, qualification, and improvement activities.
• Assist in process optimization and continuous improvement projects.
• Collect, analyze, and interpret manufacturing data to support decisions.
• Conduct technical research, literature reviews, and assessments.
• Support DOE, data analysis, and validation activities.
• Assist in laboratory experiments and process evaluations.
• Prepare technical reports, presentations, and documentation.
• Collaborate with cross-functional teams to achieve manufacturing and engineering objectives.

Skills

Analytical skills

Communication

Teamwork

Problem solving

Independent work

Basic semiconductor knowledge

Education

Bachelor's Degree in Electrical & Electronic Engineering

Undergraduate student (industrial training required)

3–6 months internship period

Tools

Microsoft Office

SQL

Engineering software

Job description

Intel Corporation in Malaysia, Kulim is seeking a Module Engineering Undergraduate Intern to gain hands-on experience supporting manufacturing operations. You will work with engineers to improve equipment performance, process control, and production efficiency, while contributing to projects that drive improvements in manufacturing methodologies.

The role offers exposure to DOE, data analysis, and technical reporting, with collaboration across cross-functional teams.