Packaging Engineer (Die Attach)

Sandisk; Simpang Ampat; On-site; MYR 75,000 - 135,000; Full time

Job summary

Sandisk is seeking a Process/Pack engineering professional in Penang to drive die attach development, qualification, and transfer to high-volume manufacturing. You will lead technology development, DOE planning, and collaboration with global teams to advance memory packaging architectures.

The role emphasizes strong fundamentals in materials and process control, experience with packaging technology, and a proactive approach to problem-solving in a factory setting.

Qualifications

• Bachelor’s or Master’s Degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline.
• Min 3 years relevant working experience in engineering.

Responsibilities

• Die Attach Process Module Engineering for Process/Materials Development, Qualification and Transfer to HVM.
• Lead technology development and tech-staging for packaging solutions.
• Collaborate with global cross-functional teams across process, materials, design, and quality.

Skills

Statistical analysis

Packaging development

Analytic skills

Communication & teamwork

Self-motivation & organization

Multitasking

Education

Bachelor’s or Master’s degree in engineering

Tools

SAP

MES

Power BI

Tableau

Six Sigma Green Belt

Job description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Die Attach Process Module Engineering team for Process/Materials Development, Qualification and Transfer to HVM.
• Responsible for Key technology development & tech-staging to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
• To liaise with global cross-functional teams including process, materials, package design, thermal-mechanical simulation, quality and other related stakeholders.
• To build and nurture strong process development team related to high density ultra-thin die attach process, material and packaging architecture - emphasizing deep engineering fundamental, structured methodology and DOE planning / execution / analysis.
• To lead studies related to in-depth fundamental investigation/characterization in packaging development.
• Ensure strong materials to process/design compatibility to meet stringent quality and reliability requirements from customers and industry standards.
• To lead and drive collaboration with strategic equipment & material suppliers, service providers, academia, industry consortium in collaboration projects or co-development activities.
• To support IR5.0 Digital Transformation for Packaging process e.g. Process Digital Twins, Advanced Process Control (APC), Fault Detection Control (FDC), fundamental lab characterization and design rules definition.
• Drive yield analysis activities in process characterization and qualification phases.
• To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology.

Qualification

REQUIRED:

• Bachelor’s or Master’s Degree in Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline. Min 3 years relevant working experience, as engineering field.
• Experience in process recipe baseline (RBL) development
• Strong knowledge of manufacturing process control, SPC, FMEA, DOE, and statistical analysis.
• Experience in root cause analysis and problem-solving methodologies such as 8D, 5 Why, Fishbone, and DMAIC.

Prefered

• Experience in semiconductor Die Attach Process with DAF application
• Knowledge of reliability testing and failure analysis techniques.
• Familiarity with SAP, MES, Power BI, Tableau, or similar analytical tools. Certified Six Sigma Green Belt.

Skills

• Proficiency in statistical data analysis using JMP/MINITAB software.
• Strong hands-on experience Packaging technology development experience and well-versed with structured R&D methodology.
• Strong analytic skills and problem-solving skills.
• Passionate about technology and continuous improvement in a factory environment.
• Strong communication and teamwork skills.
• Self-motivated, organized, and able to manage multiple tasks in a dynamic environment

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.