Packaging Mechanical Design Engineer: Thermal & CFD

Sandisk; Penang; On-site; MYR 90,000 - 140,000; Full time

Job summary

Sandisk in Penang seeks a Packaging Engineer to drive thermal designs across packaging levels and PCBA assemblies. The role focuses on CFD modeling, analytical validation, and measurements to meet tight form-factor and thermal constraints.

The candidate should have a B.S. in Mechanical Engineering with 5+ years of related experience, strong CAD skills, and a background in plastic injection molding or metal fabrication. Collaboration with suppliers is integral to releasing products on schedule.

Qualifications

• B.S. in Mechanical Engineering with 5+ years in industry.
• Solid knowledge in mechanical design and CAD tools.
• Experience with outside suppliers and contract manufacturers a plus.

Responsibilities

• Perform thermal design and CFD modeling for packaging levels.
• Validate flash PCBA and host level designs with measurements.
• Address small form factor constraints in packages and environments.

Skills

Mechanical design

CAD software

Tolerance analysis

Vendor collaboration

Injection molding

Education

B.S. in Mechanical Engineering

Tools

SolidWorks

AutoCAD

Job description

Sandisk in Penang seeks a Packaging Engineer to drive thermal designs across packaging levels and PCBA assemblies. The role focuses on CFD modeling, analytical validation, and measurements to meet tight form-factor and thermal constraints.

The candidate should have a B.S. in Mechanical Engineering with 5+ years of related experience, strong CAD skills, and a background in plastic injection molding or metal fabrication. Collaboration with suppliers is integral to releasing products on schedule.