Senior Die Prep & Process Module Engineer

SanDisk; Batu Kawan; On-site; MYR 90,000 - 150,000; Full time

Job summary

Sandisk in Penang, Malaysia, is seeking a Senior Process Module Engineer in a full-time on-site role at the Penang SDSM Office. The position focuses on Die Prep process development, equipment solutions, and qualification from development to high-volume manufacturing.

You will lead cross-functional teams, set up new recipes for Die Prep (back-grinding, mounting, laser-related steps), perform window studies and DOEs, and drive process qualifications to achieve UPH, yield and cost targets.

Qualifications

• Bachelor or higher Engineering degree (Electrical/Mechanical, etc).
• 2–7 years in semiconductor process development.
• Experience with disco machines and die prep is preferred.
• Knowledge of semiconductor assembly processes.
• FMEA, SPC, 8D, Six Sigma (certification) & related tools like Minitab/JMP.

Responsibilities

• Die Prep New Process Development and equipment solutions to meet Quality, Cost, UPH and Development targets.
• New Die Prep Process Development for wafer technology, new products, qualifications and machine qualifications.
• Setup new recipes for Die Prep processes; perform window studies, DOEs and corner limits.
• Golden recipe setup for new package qualification.
• Process Qualification to meet critical quality requirements, CPk, UPH, Yield and cost targets.
• Transfer processes from Development to New Product Introduction and across sites.
• Collaborate with cross-site product development and design teams on Package Design Rules.

Skills

Self-motivated

Initiative

Project planning

Communication

Team leadership

AI and machine learning

Able to work long hours

Education

Bachelor or higher Engineering degree

Tools

Minitab

JMP

DOE

Job description

Sandisk in Penang, Malaysia, is seeking a Senior Process Module Engineer in a full-time on-site role at the Penang SDSM Office. The position focuses on Die Prep process development, equipment solutions, and qualification from development to high-volume manufacturing.

You will lead cross-functional teams, set up new recipes for Die Prep (back-grinding, mounting, laser-related steps), perform window studies and DOEs, and drive process qualifications to achieve UPH, yield and cost targets.