Packaging Engineer: SMT & AI-Driven Process Modules

Sandisk; Simpang Ampat; On-site; MYR 120,000 - 180,000; Full time

Job summary

Sandisk Penang PTDI is seeking a Process Module Engineer to join a new team building an SSD-focused tech development group at the Batu Kawan facility. You will drive SMT material and process development, packaging improvements, and pilot-to-production transitions for next-gen SSD products.

Ideal candidates hold a Bachelor's or Master's in Mechanical, Electrical, or Materials Engineering with 5 years in the semiconductor sector, plus strong DOE and statistical skills.

Qualifications

• Bachelor/Master in Mechanical/Electrical/Material Science/Engineering required.
• 5 years of relevant work experience within semiconductor industry.

Responsibilities

• Defines SSD package/IC/SSD drive requirements.
• Develops SSD assembly and packaging material and processes to meet quality and cost goals.
• Develops new package and SMT process qualification programs.
• Plans and conducts experiments to characterize materials and processes.
• Transfers process to high volume manufacturing and provide support in new factory start-up.
• Acts as a liaison with suppliers/vendors.

Skills

SMT material

Process development

Package design

Qualification testing

Statistical analysis

Education

Bachelor/Master in Mechanical/Electrical/Material Science/Engineering

Tools

JMP

Minitab

Excel

Job description

Sandisk Penang PTDI is seeking a Process Module Engineer to join a new team building an SSD-focused tech development group at the Batu Kawan facility. You will drive SMT material and process development, packaging improvements, and pilot-to-production transitions for next-gen SSD products.

Ideal candidates hold a Bachelor's or Master's in Mechanical, Electrical, or Materials Engineering with 5 years in the semiconductor sector, plus strong DOE and statistical skills.