Packaging Engineer – Process Module Innovation (Penang)

SanDisk; Batu Kawan; On-site; MYR 60,000 - 90,000; Full time

Job summary

SanDisk Penang PTDI division seeks a Packaging Engineer (Process Module Development) to advance SSD packaging and material processes for next‑gen products at the Batu Kawan facility. You will lead pathfinding, qualification, and ramp to high‑volume production, interfacing with suppliers and internal teams.

You will apply DOE, metrology and statistical tools to improve quality, yield, and cost, while coordinating new process introductions and ensuring robust reliability across product families.

Qualifications

• Bachelor/Master in Mechanical/Electrical/Material Science/Engineering required.
• 5 years of relevant work experience within semiconductor industry.
• Experience in SMT material and process development preferred.
• Strong problem-solving with DOE and metrology knowledge.
• Excellent cross-functional collaboration and communication.

Responsibilities

• Defines IC package/SMT/SSD drive requirements, goals and milestones for SSD product groups.
• Develops SSD assembly and IC packaging material and processes to meet quality and yield goals.
• Creates package and SMT process qualification programs.
• Updates specifications for ICs and semiconductor assemblies.
• Plans experiments to characterize materials and processes from pathfinding to ramp.
• Improves quality, reliability, cost, yield and productivity using statistical tools.
• Establishes process control systems and product recipes.
• Transfers processes to high volume manufacturing and supports new factory start-up.
• Acts as liaison with suppliers/vendors.
• Maintains product quality while introducing cost-reduction programs.
• Coordinates introduction of new package processes into production.

Skills

AI/ML experience

Machine fingerprinting

Statistical analysis

Verbal and written communications

Team leadership

Education

Bachelor/Master in Mechanical/Electrical/Materials Science/Engineering

Tools

Minitab

JMP

Job description

SanDisk Penang PTDI division seeks a Packaging Engineer (Process Module Development) to advance SSD packaging and material processes for next‑gen products at the Batu Kawan facility. You will lead pathfinding, qualification, and ramp to high‑volume production, interfacing with suppliers and internal teams.

You will apply DOE, metrology and statistical tools to improve quality, yield, and cost, while coordinating new process introductions and ensuring robust reliability across product families.